MTT

Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.

The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.

The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.

The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.

The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.

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Solder Joint Reliability

Solder Joint Quality Assessment

Numerical Simulation Analysis

UL Certification Consultation

High Temperature and High Humidity Test

Corrosion Resistance Test

Particulate Cleanliness

Foreign Object Analysis

Tin Whiskers Observation

Ionic Cleanliness

Temperature Cycling Test

Slicing Analysis

Intermetallic Compound

PCB Stress-Strain Test

PCBA Solder Joint Quality Assessment

Dyeing Test

PCBA Welding Process Qualification

Solder Mask

PCB Physical Property Test

Visual Inspection

Mechanical strength of solder joints

Plated Through-Hole Test

Dynamic thermal deformation (curvature)

TMA Test

Thermogravimetric Analysis

Differential Scanning Calorimeter

Thermal Conductivity

Combustion Test

Principal Component Analysis of Insulation Substrate

Mechanical Property Testing

Thermal Stress Test

Dimensional Measure

ECM/CAF Test

PCB Hazardous Substance Detection

PCB Electrical Performance

Vibration Test

Copper Purity Of Conductor

Solderability Test

Control Of Incoming Electronic Materials

Reliability Assessment Of Electronic Accessories

Compatibility Assessment Of Electronic Accessories And Processes

Selection And Evaluation Of Electronic Accessories

Cleaning Agent Test

Flux Test

Three-Proof Paint Test

Volatile Organic Compounds

Red Phosphorus Detection

Siloxane Test

ELV Test

Phthalate

Asbestos

Polycyclic Aromatic Hydrocarbons

Toxic Substances Control Act

PFAS

POPs Control

California 65

Registration, Evaluation, Authorization, and Restriction of Chemicals

RoHS Regulations

Halogen/Sulfur Content

Shear/Torsion Test

Microscopic Metallographic Analysis

Wear Test

High-Temperature Mechanics

Peel Strength Test

Surface Roughness

Non-metallic inclusions

Grain Size

Macroscopic Metallographic Analysis

Welding Residual Stress

Brand Identification/Recommendation

Electrical Properties (metal)

Depth Measurement Of Carburizing/Nitriding/Hardening Layer

Melting Point Test（Metal）

Hardness Test

Principal Component Analysis

Total Component Analysis

Material Thermal Analysis

Phase Analysis

Fiberglass Content

Ash Content

Flame Retardant Test

Specific Heat Capacity Test

Thermal Expansion Coefficient Test

Glass Transition Temperature

Melting Point Test (Polymer)

Fatigue Test

Impact/Toughness Test

Bending Compression Test

Tensile Test

Temperature and Humidity Cyclic

Surface Insulation Resistance

Rapid Temperature Change Test

The Three-Combination Test

Drop Test

Mechanical Shock Test

Dust Test

Salt Spray Corrosion Test

Flow Gas Corrosion Test

Thermal Shock Test

High Temperature / Low Temperature Storage

Purified Water Physicochemical Analysis

Total Bacterial Count

Total Dissolved Solids

pH Value

Conductivity

Total Organic Carbon

Elemental Analysis

Ionic Analysis

Microscopic Analysis

X-ray Diffraction

Optical Microscope

Time of Flight Secondary Ion Mass Spectrometry

Dynamic Secondary Ion Mass Spectrometry

X-ray Photoelectron Spectroscopy

EBSD

AFM

Nanoindentation/Nanohardness

Basic Performance Test of Automotive Thermal Management

Automotive Electronic Reliability Testing

PCBA/PCB Testing and Analysis Services

Automotive Electronic Component Test

Connector End Plate Test

Mechanical Testing Of Connectors

Connector Environmental Testing

Electrical Performance Testing Of Connectors

Terminal Mechanical Performance Testing

Mechanical Reliability

Environmental Reliability

Electrical Performance Reliability

Component Fatigue Life Test

AEC-Q器件可靠性评价

Corrosion Resistance Test

成分分析

Particulate Cleanliness Test

Gravel Impact Test

Abrasion Test

Nondestructive Test

Non-Metallic Materials

Metal Material

Coating/Plating Detection

Performance testing of automotive materials

Automotive Pipeline Performance Test

汽车禁用物质/ELV

Cells Contact System

Transmission Electron Microscopy

Fault Diagnosis Test

Multi Functional Solder Joint Test

Industrial CT

Focused Ion Beam

Cross-section Polisher

Optical Beam Induced Resistance Change

Thermal EMMI

EMMI Localization

Glass Passivation Layer

Delayering Test

Cratering Test

Sample Preparation Microscopy

Internal Visual Inspection

Laser Decapsulation

Strength Test

External Visual Inspection

C-SAM

SEM

AES

Excitation Test

Reproduction Test

CDM ESD

HBM ESD

X-RAY

Board-Level Failure Analysis

Whole-Machine Failure Analysis

Hardware White-Box Testing Projects

Component Failure Analysis

Sealing Device

Capacitive MLCC

Expired Material – IC

Counterfeit/Refurbished Device

Plastic-encapsulated Devices

人体模型（HBM）静电放电及闩锁（LU）

Latch-up

Chip Aging and Lifetime Test

Chip Reliability Hardware Design Services

Chip Packaging Reliability Environmental Tests

Automotive Chip Electronic Reliability Testing

Evaluation Of New Materials/New Processes

硬件白盒测试

Localization Device Certification

EHMS

Mixed Oil Analysis

Component Analysis

Debris Analysis

Oil Filter Analysis

Oil Quality Testing

Reliability test

腐蚀试验

Nondestructive Testing

显微分析

异物分析

Bending Test

Long-term Creep Test

Shear Test

硬度测试

Compression Test

Advanced Material Characterization

Destructive physical Analysis

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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.

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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.

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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.

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Professional verification platform, delivering precise data insights to build a solid foundation of trust for investors.

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Semiconductor Solutions

Focus on the full-semiconductor industry chain testing services, covering solutions from chip design to wafer foundry/production, packaging or testing, soldering and assembly (SMT), complete machine assembly/product verification, and end-use. Leveraging core technologies in failure analysis and reliability verification

Free Consultation

Service Offerings

Individual Testing Items

Failure Analysis

Destructive Physical Analysis

Device Reliability

Technical Consulting

Individual Testing Items

MTT has a professional semiconductor analysis team, which can provide services from chip design to wafer foundry/production, packaging or testing, soldering and assembly (SMT), complete machine assembly/product verification, and end-use solutions for semiconductor devices, and offer precise solutions for every customer who wants to solve product quality problems.

Failure Analysis

By uncovering root causes of failure such as design flaws, process deviations, material issues, or operational stresses, this approach not only provides a foundation for quickly removing current product faults and improving yield, but also drives iterative optimization of design and manufacturing processes. This effectively prevents the recurrence of similar issues, ensures high reliability of semiconductor products and serves as a core technological safeguard for enhancing market competitiveness.

Destructive Physical Analysis

Destructive Physical Analysis (DPA for short) is a process of non-destructive and destructive analysis and inspection of component samples by sampling from production batches. DPA analysis technology can proactively identify potential defects in materials, processes, and other aspects of components. Although the precise timing of failures caused by such defects cannot be predicted, the consequences they may trigger are often severe.

Device Reliability

Semiconductor device reliability testing evaluates the capability of a device to perform its specified functions over a defined period of time by subjecting it to various stress conditions that simulate actual operating environments. By detecting potential defects in advance, this process ensures component quality, safeguards the stable operation of electronic systems, and enhances product competitiveness.

Technical Consulting

MTT provides comprehensive technical consulting services, covering material selection and certification, domestic device certification, reliability evaluation of new devices, analysis of new process structures and technologies, failure analysis technology training, hardware white-box testing, and quality improvement projects, to help enterprises improve product quality and reliability and promote technological innovation and development.

Core Advantages

Authoritative Certification and Rigorous Quality Control

The laboratory has established a comprehensive and rigorous quality management system, strictly adhering to international standards for management and operation. Testing solutions are flexibly adapted to meet diverse regulatory requirements across different markets, thereby satisfying customers’ varied testing needs.
Dynamic Customization for Cost Reduction and Efficiency Enhancement

It constructs a closed-loop service system of "demand research - solution design - dynamic adjustment", and provides in-depth "industrial hospital"-style testing solutions according to the characteristics of semiconductor products, precisely matching the special needs of each stage of R&D/production.
Composite Technical Team

Bringing together professionals from multiple disciplines—including materials engineering, electronic information, communication engineering, and optoelectronic information—the company has built a multidisciplinary technical team capable of delivering multidimensional solutions to meet complex testing requirements.
Cutting-Edge Equipment for Precision Empowerment

It is equipped with high-end equipment such as FIB (Focused Ion Beam), TEM, SEM/XPS, and Thermal EMMI, covering micro-structure analysis and device reliability equipment, to achieve all-round and precise diagnosis from materials to devices.