Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Cross-section Polisher

An Ion Milling Instrument, commonly referred to in the industry as a Cross-Section Polisher (CP), is a sample preparation method free of contamination and mechanical stress. 

Cross-section Polisher

| Project Overview

 

An Ion Milling Instrument, commonly referred to in the industry as a Cross-Section Polisher (CP), is a sample preparation method free of contamination and mechanical stress. Samples that cannot be prepared using conventional sectioning methods can all be processed with an ion milling system. This technique is suitable for handling soft materials, ultra-hard alloys, brittle materials, soft–hard composite materials, and porous materials, such as colloids, paper,

hard alloys, ceramics, semiconductors, glass, and polymer materials. 

 

 

| Testing Principle

 

After argon gas is ionized, it is accelerated by an electric field to strike the sample surface, generating microscopic vibrations, impacts, or breakdown explosions that damage the surface structure, causing fragments to detach and thereby achieving delayering or cutting effects. By adjusting parameters such as accelerating voltage, ion beam current, and incident angle, the grinding speed and extent of sample damage can be controlled, ensuring optimal observation results.

 

 

 

| Typical Case 1

 

Lithium battery electrode sheets are highly reactive with water and oxygen (and may even ignite), thus requiring sample preparation under dry or vacuum conditions. Since the sintered lithium material on metal foils easily detaches or pulverizes, mechanical grinding methods are unsuitable, whereas ion milling provides perfect sample preparation.

 

 

| Typical Case 2

 

Magnetic core samples are characterized by high hardness, wear resistance, fragility, and porous structures, while the polymer binder has low hardness. This makes them soft–hard composite materials, and mechanical grinding often results in problems such as residual scratches, foreign matter filling pores, or stress-induced fractures. By employing ion milling, the pore structure and magnetic particle coating layers can be preserved completely, along with other critical information.

 

 

| Typical Case 3

 

For miniature PCB blind via structures exhibiting abnormally high impedance, initial suspicion suggested contamination at the via bottom. Conventional slicing methods could not confirm the presence or type of contamination. Therefore, ion milling was employed for sample preparation, preserving the complete morphology of foreign substances (including porous structures) as well as their elemental composition.

 

 

 

| Typical Case 4

 

In shale samples, mechanical grinding (left image) caused severe deformation, making it impossible to observe internal structural details. In contrast, ion milling (right image) preserved the internal structure intact, clearly revealing the detailed morphology.

 

 

| MTT Advantages

 

1. Professional Team: A team of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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