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Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Solder Joint Reliability
Solder Joint Quality Assessment
Numerical Simulation Analysis
UL Certification Consultation
High Temperature and High Humidity Test
Corrosion Resistance Test
Particulate Cleanliness
Foreign Object Analysis
Tin Whiskers Observation
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PCBA Solder Joint Quality Assessment
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Solder Mask
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Visual Inspection
Mechanical strength of solder joints
Plated Through-Hole Test
Dynamic thermal deformation (curvature)
TMA Test
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Differential Scanning Calorimeter
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Principal Component Analysis of Insulation Substrate
Mechanical Property Testing
Thermal Stress Test
Dimensional Measure
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PCB Hazardous Substance Detection
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Vibration Test
Copper Purity Of Conductor
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Ash Content
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Mechanical Reliability
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Component Fatigue Life Test
AEC-Q器件可靠性评价
Corrosion Resistance Test
成分分析
Particulate Cleanliness Test
Gravel Impact Test
Abrasion Test
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Non-Metallic Materials
Metal Material
Coating/Plating Detection
Performance testing of automotive materials
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SEM
AES
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CDM ESD
HBM ESD
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Board-Level Failure Analysis
Whole-Machine Failure Analysis
Hardware White-Box Testing Projects
Component Failure Analysis
Sealing Device
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Expired Material – IC
Counterfeit/Refurbished Device
Plastic-encapsulated Devices
人体模型（HBM）静电放电及闩锁（LU）
Latch-up
Chip Aging and Lifetime Test
Chip Reliability Hardware Design Services
Chip Packaging Reliability Environmental Tests
Automotive Chip Electronic Reliability Testing
Evaluation Of New Materials/New Processes
硬件白盒测试
Localization Device Certification
EHMS
Mixed Oil Analysis
Component Analysis
Debris Analysis
Oil Filter Analysis
Oil Quality Testing
Reliability test
腐蚀试验
Nondestructive Testing
显微分析
异物分析
Bending Test
Long-term Creep Test
Shear Test
硬度测试
Compression Test
Advanced Material Characterization
Destructive physical Analysis
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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CDM ESD

Charged Device Model (CDM) Electrostatic Discharge (ESD) refers to a situation where a device accumulates static electricity inside due to friction or other factors, but during the accumulation process, the device itself is not damaged. 

CDM ESD

| Project Overview

 

Charged Device Model (CDM) Electrostatic Discharge (ESD) refers to a situation where a device accumulates static electricity inside due to friction or other factors, but during the accumulation process, the device itself is not damaged. When this electrostatically charged device is handled, once its pins come into contact with a grounded surface, the internal static charge of the device flows out through the pins, thereby causing a discharge phenomenon.

 

 

| Test Objective

 

To simulate the discharge event when the device is connected to ground and evaluate the device’s tolerance to electrostatic discharge (ESD).

 

 

| Test Standard

 

JEDEC JS-002-2022 Electrostatic Discharge Sensitivity Testing Charged Device Model (CDM) Device Level.

 

 

| Service Products / Fields

 

Automotive electronics manufacturing, packaging, and testing processes.

 

 

| Project Advantages

 

1. High-definition cameras (three: XY, Z) for convenient and rapid positioning of the device under test.

 

2. High-performance motion servo system (minimum motion step of 1 μm).

 

3. Supports batch testing of multiple systems.

 

4. Sealed environmental chamber to improve the efficiency of drying units.

 

 

| Testing Principle

 

 

 

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Transmission Electron Microscopy Fault Diagnosis Test Multi Functional Solder Joint Test Industrial CT Focused Ion Beam Cross-section Polisher
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