Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Professional verification platform, delivering precise data insights to build a solid foundation of trust for investors.
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Chip Reliability Hardware Design Services

MTT has a dedicated hardware design team with extensive experience in customer communication and design collaboration. Upholding a customer-oriented service approach, and through direct discussions and adjustments, we deliver high-quality solutions with rapid turnaround, assisting clients in gaining first-mover advantages in competitive markets.

Chip Reliability Hardware Design Services

| Chip Reliability Hardware Design Services

 

Customized service solutions can be provided, covering chip design, manufacturing, and testing, to ensure the stability and reliability of product quality.

 

MTT has a dedicated hardware design team with extensive experience in customer communication and design collaboration. Upholding a customer-oriented service approach, and through direct discussions and adjustments, we deliver high-quality solutions with rapid turnaround, assisting clients in gaining first-mover advantages in competitive markets.

 

 

| Project Background

 

The key to chip reliability testing lies in hardware design, which enables the true performance of the chip to be fully demonstrated. MTT has a dedicated hardware design team with extensive experience in customer communication and design collaboration. Upholding a customer-oriented service approach, and through direct discussions and adjustments, we deliver high-quality solutions with rapid turnaround, assisting clients in gaining first-mover advantages in competitive markets.

 

MTT’s current scope of hardware services includes:

Schematic Design

PCB Layout

Outsourced Fabrication of PCB and PCBA

Hardware Quality Testing and Verification

Procurement of Special Component Specifications

High-Frequency RF Design and Fabrication

Chip Reliability Hardware Design

 

 

| Schematic Design

 

OrCAD is employed for schematic design. Hardware development is carried out according to the customer’s IC requirements, with schematics drawn to match, and hardware subsequently produced in line with the schematic design. With years of accumulated expertise, CTI Huace Testing Technology incorporates considerations such as experimental project requirements, equipment compatibility, power distribution schemes, and circuit impedance matching into schematic design, striving to achieve stable quality.

 

In addition, the OrCAD BOM management system has been introduced to ensure that component specifications in schematic design are accurate. This system can link with internally available material categories, perform automated checks of component specifications, connectivity, and pin assignments, thereby reducing accidental errors. It further enables early decisions on whether new materials need to be procured, providing faster confirmation and shortening delivery cycles.

 

| PCB Layout

 

PCB layout is carried out based on the schematic design, implementing the layout and functionality required by the circuit designer. CTI Huace Testing Technology employs two PCB circuit design software platforms—Allegro and PDAS—both of which are currently mainstream tools in the market. By adopting an independent layout approach, schematic designers and circuit designers can interface directly, allowing for rapid adjustments and optimizations that significantly shorten development time. This includes support for various stack-up structures, blind and buried via design, back drilling, impedance matching, and material selection, with comprehensive technical consultation services available. Allegro software, with its powerful auxiliary design features, assists designers in completing layouts quickly and reducing error rates. It is currently the most widely used application software in the industry and serves as the primary tool at Huace Technology.

 

| PCBA Quality Inspection

 

All completed hardware products shall undergo and pass 100% of CTI’s internal PCBA quality inspection procedures. The foremost priority in quality inspection is resistance measurement. MTT has introduced an Agilent high-resistance meter to measure the high resistance of PCBs and key components, as well as the parameters of insulation materials, electronic components, and electromechanical assemblies. The DC resistance measurement range extends from 10³ Ω to 1.6 × 10¹⁶ Ω. This extremely broad resistance measurement range enables precise testing of resistance parameters for capacitors, relays, switches, connectors, cables, and PCBs, ensuring that no potential risks exist.

 

| MTT Hardware Categories

 

HTOL and HAST Dedicated Board Fabrication

King Yuan Public Board

DI Public Board

Socket Card Design and Fabrication

DUT Card Design and Fabrication

MCC LC2 (V2SR) Dedicated Board

MCC LC2 Independent Temperature-Controlled Public Board

MCC HPB 5 Series Dedicated Board

MCC HPB 4 Dedicated Board

High-Frequency RF Architecture Design and Fabrication

Other Burn-In Application Dedicated Board Design and Fabrication

 

 

| MTT Advantages

 

1. Professional Team: A team of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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