Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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PCB Stress-Strain Test

With the continuous progress of miniaturization and high integration of electronic products, the indispensable and important mounting process is also widely used. However, mounted components are prone to breakage under the influence of PCB deformation.

PCB Stress-Strain Test

| Project Background

 

With the continuous progress of miniaturization and high integration of electronic products, the indispensable and important mounting process is also widely used. However, mounted components are prone to breakage under the influence of PCB deformation. Especially with the implementation of the lead-free process directive and the increase in soldering temperature, the PCB stress during the assembly and soldering process is increased, which doubles the fragility of the solder joints and increases the risk of solder cracks. Some solder cracks do not cause the immediate failure of the component's function. Therefore, a series of subsequent tests such as functional tests will not detect the defects. The function may fail during product assembly or within the warranty period after leaving the factory, thus increasing the economic cost of the enterprise and affecting the promotion of the product brand.

 

 

| Project Overview

 

First, analyze the PCB according to the operation process and select the test points. Second, prepare the PCB circuit board, grind and clean it. Then select a suitable strain gauge for pasting, label the pasted strain gauges and number them, and make preparations for strain measurement. Third, connect the strain gauge sensor to the data acquisition device, run the test program, and collect strain data. 

 

 

| Test Objective

 

1. PCB stress-strain test or board-splitting stress;

 

2. PCB stress-strain test or board-splitting stress;

 

3. Provide feedback basis for PCB design and panel layout.

 

 

| Testing Standards

 

IPC-JEDCE 9704 Printed Circuit Board Strain Testing Guide

 

 

| Service Products / Fields

 

Consumer electronics, automotive electronics, electronic manufacturing, PCB design and materials science, reliability engineering and failure analysis, mechanics and sensing technology, etc.

 

 

| Test Items

 

1. Select strain gauges;

 

2. Prepare the PCB board and paste the strain gauges;

 

3. Measure the strain;

 

4. Analyze and record the data.

 

 

| MTT Advantages

 

1. Professional Team: Equipped with a number of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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