Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Professional verification platform, delivering precise data insights to build a solid foundation of trust for investors.
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Material Thermal Analysis

MTT's thermal analysis engineers have excellent practical experience and a wealth of case accumulations. Meanwhile, MTT has a professional thermal analysis laboratory and sophisticated thermal analysis instruments and equipment, providing you with comprehensive, high-quality and convenient testing services.

Material Thermal Analysis

| Project Overview

 

It is a technology that measures the physical properties of substances as they change with temperature under programmed temperature control.

It studies the properties and changes of substances or identifies and classifies substances by measuring the changes in physical properties during the heating or cooling process of substances. Physical properties include the mass, temperature, enthalpy, size, mechanical, acoustic, electrical and magnetic properties of substances.

 

 

| Test Objective

 

Material thermal analysis can quickly and accurately measure changes such as crystal form transformation, melting, sublimation, adsorption, dehydration and decomposition of substances, and has a wide range of applications in characterizing the thermal, physical, mechanical properties and stability of materials.

It is of great practical significance for the research on the physical and chemical properties of inorganic, organic and polymer materials and the quality control in the production of related materials.

 

 

 | Test Methods

 

Commonly used material thermal analysis techniques

There are a wide variety of thermal analysis methods. According to the induction and classification of the International Confederation for Thermal Analysis and Calorimetry (ICTA), there are currently nine categories and seventeen types of thermal analysis methods. Among these thermal analysis techniques, differential scanning calorimetry, thermogravimetric analysis, thermomechanical analysis, dynamic thermomechanical analysis and thermal conductivity testing are the most widely used.

 

① Differential scanning calorimetry analysis (DSC analysis)

During the temperature change process (heating/cooling/isothermal), measure the change in the heat flow difference between the sample and the reference material.

Using a DSC, we can study the melting and crystallization processes, crystallinity, glass transition, phase transition, liquid crystal transition, oxidation stability (oxidation induction time O.I.T.), reaction temperature and reaction enthalpy of materials, measure the specific heat and purity of substances, study the compatibility of polymer blends, the curing process of thermosetting resins, and conduct reaction kinetics research, etc.

 

② Thermogravimetric analysis (TGA)

During the temperature change process (heating/cooling/isothermal), measure the change in the weight of the sample with temperature or time.

Using thermogravimetric analysis, we can determine the stability and oxidation stability of materials under different atmospheres, analyze physical and chemical processes such as decomposition, adsorption, desorption, oxidation, and reduction (including further conducting apparent reaction kinetics research using TG test results), perform quantitative calculations of the composition of substances, and determine the contents of moisture, volatile components, and various additives and fillers.

 

③ Thermomechanical analysis (TMA)

The basic principle of this technique is to measure the deformation of the sample during a certain load and temperature program (heating/cooling/isothermal and their combinations).

The following characteristics of materials can be studied using a thermomechanical analyzer:

Linear expansion and contraction

Glass transition temperature

Densification and sintering processes

Optimization of heat treatment processes

Softening point detection

Phase transition process

Research on reaction kinetics

 

 

④ Dynamic thermomechanical analysis (DMA)

Place the sample under a programmatically controlled temperature and apply a single-frequency or multi-frequency oscillatory force to study the mechanical behavior of the sample and measure the functional relationships of its storage modulus, loss modulus, and loss factor with temperature, time, and the frequency of the force.

Widely used in the fields of thermoplastics and thermosetting plastics, rubbers, coatings, metals and alloys, inorganic materials, composite materials, etc.

 

⑤ Thermal conductivity test

1. Steady-state heat flow method

Suitable for testing the equivalent thermal conductivity and thermal impedance of homogeneous and non-homogeneous thermally conductive and electrically insulating thermal interface materials.

2. Laser flash method (LFA)

This method is a non-contact and non-destructive measurement technique. It can not only directly measure the thermal diffusivity accurately, but also calculate the thermal conductivity by multiplying the specific heat capacity and density of the sample.

 

 

| Test Items

 

Parameter

Test method

Temperature range

熔点、熔融热焓、结晶温度、结晶热焓

Melting point, enthalpy of fusion, crystallization temperature, enthalpy of crystallization

差示扫描量热分析

DSC

Differential scanning calorimetry analysis

 DSC

-100℃~550℃

-100°C~550°C

比热容

Specific Heat Capacity

差示扫描量热分析

DSC

Differential scanning calorimetry analysis

 DSC

-100℃~550℃

-100°C~550°C

玻璃化转变温度

Glass transition temperature

差示扫描量热分析

DSC

Differential scanning calorimetry analysis

 DSC

-100℃~400℃

-100°C~400°C

热机械分析

TMA

Thermomechanical analysis

 TMA

-100℃~400℃

-100°C~400°C

动态热机械分析

DMA

Dynamic thermomechanical analysis

 DMA

-100℃~400℃

-100°C~400°C

热裂解温度

Thermal cracking temperature

热重分析

TGA

Thermogravimetric analysis

 TGA

室温~800℃

Room temperature~800°C

热膨胀系数

Thermal expansion coefficient

热机械分析

TMA

Thermomechanical analysis

 TMA

-100℃~900℃

-100°C~900°C

爆板时间

Delamination time

热机械分析

TMA

Thermomechanical analysis

 TMA

室温~300℃

Room temperature~300°C

 

 

| MTT Advantages

 

1. Professional Team: A team of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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