Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Solder Joint Reliability

The quality evaluation of PCBA solder joint reliability is a core link in the field of electronic manufacturing. 

Solder Joint Reliability

The quality evaluation of PCBA solder joint reliability is a core link in the field of electronic manufacturing. The need to conduct liability and quality evaluation was first put forward in light of the fact electronic products are expected to become high-density, multi-functional and highly reliable. As components become smaller and some packaged components with hidden solder joints become prevalent, traditional visual inspection can no longer meet the quality requirements. It is necessary to comprehensively inspect through means such as X-ray and slice analysis, and comprehensively evaluate key quality indicators such as solder joint porosity, wettability and shear strength. In the process of comprehensive evaluation, the quality of solder joints is evaluated through reliability tests and accelerated aging to meet the strict standards for product reliability in industries such as automotive electronics, aerospace and medical equipment, which further promotes the standardization and refinement of the solder joint quality evaluation system.

 

 

| Project Background

 

As electronic products become increasingly high-density and multi-functional, the soldering quality of PCBA has become a core factor in ensuring product reliability.

More and more industry standards have put forward strict requirements for the appearance and porosity of PCBA solder joints. In fields such as automotive electronics and aerospace, relevant certifications are required to ensure that the soldering quality meets the requirements before large-scale production. Therefore, inspection of PCBA soldering quality is crucial for the process production. In addition, soldering defects may lead to high rework costs and legal risks. Soldering quality evaluation test has become a key means to optimize parameters, improve efficiency and control quality.

 

 

| Project Overview

 

PCBA soldering quality inspection is a systematic testing process to verify the correctness of the proposed soldering process and ensure the stability and reliability of soldering quality. Its core lies in providing scientific verification for formal production through the detection of actual soldered products and data analysis.

 

 

| Test Objective

 

1. Verify the rationality of soldering process parameters;

2. Ensure the stability and consistency of soldering quality;

3. Comply with industry standards and regulatory requirements;

4. Optimize production efficiency and cost control;

5. Support new product development and process innovation.

 

 

| Testing Standards

 

IPC-A-610, IPC-TM-650, IPC-7095, etc.

 

 

| Service Products / Fields

 

Consumer electronics, automotive electronics, aerospace, etc.

 

 

| Test Items

 

Non-destructive testing (visual inspection, X-ray fluoroscopy inspection, ion cleanliness);

Destructive analysis (cross-section analysis, dyeing test, solder joint strength, morphology observation, elemental analysis, etc.).

 

 

| Project Advantages

 

1. Visual inspection can accurately determine whether the solder joints meet the requirements of standard IPC-A-610;

 

2. X-ray fluoroscopy inspection can quantitatively evaluate whether the void ratio of each BGA solder joint meets the requirements of standard IPC-7095;

 

3. Ion cleanliness is evaluated using ion chromatography to detect ionic residues on the surface of PCBA, including cations, anions, and weak organic acids. This helps prevent failures caused by corrosion;

 

4. Cross-section analysis can reveal the internal microstructure of solder joints and monitor the growth of the alloy layer;

 

5. Dyeing test comprehensively evaluates the soldering quality of solder joints;

 

6. Solder joint strength quantitatively evaluates the push-pull force value of solder joints.

 

 

| MTT Advantages

 

1. Professional Team: The technical expert team has rich experimental experience and provides professional, rapid and comprehensive testing services.

 

2. Advanced Equipment: It has many advanced instruments and equipment and is recognized by CMA/CNAS qualifications to ensure the accuracy and reliability of the testing results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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