Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Optical Microscope

Industries are placing increasing emphasis on issues such as product appearance, with ever-stricter requirements for manufacturing processes. The appearance grading of a product largely reflects its overall quality. 

Optical Microscope

| Overview of Optical Microscopy Project

 

An optical microscope utilizes the principle of convex lens magnification imaging to enlarge minute objects invisible to the naked eye into sizes that can be discerned by human vision. Its primary function is to increase the visual angle of small nearby objects for the eye (objects with larger visual angles produce larger images on the retina). The wavelength of ordinary light is 400–700 nm, and the optimal resolution of an optical microscope is 0.2 μm, whereas the resolution of the human eye is 0.2 mm. Therefore, the maximum magnification of an optical microscope is generally 1000×. A typical optical microscope is equipped with multiple interchangeable objective lenses, allowing the observer to adjust magnification as required. Since visible light is used as the light source, an optical microscope is highly sensitive and accurate in color recognition. It can observe not only the surface structure of a sample but also tissues beneath the surface within a certain depth.

 

 

| Test Objective

 

Industries are placing increasing emphasis on issues such as product appearance, with ever-stricter requirements for manufacturing processes. The appearance grading of a product largely reflects its overall quality. By using optical magnification devices to inspect product appearance, assembly, and surfaces for defects such as cracks, holes, and poor soldering, it is possible to verify production line processes, assess the quality of printed circuit boards, and detect soldering defects in electronic components. This facilitates monitoring of manufacturing workflows, enables timely corrective actions based on inspection results, and provides guidance for production operations and product quality assurance, thereby ensuring that products meet the shape, fit, and functional requirements under their final operating conditions.

 

 

| Testing Standards

 

IPC-6012 Qualification and Performance Specification for Rigid Printed Boards

IPC-A-610 Acceptability of Electronic Assemblies

IPC-A-600 Acceptability of Printed Boards

 

 

| Project Advantages

 

An optical microscope is characterized by convenient operation, intuitive observation, and high inspection efficiency. It is suitable for surface observation and measurement, enabling the identification and analysis of surface defects of various metals, alloys, and non-metallic products, as well as the inspection of surface phenomena in integrated circuits, printed circuit boards, wires, fibers, and surface coatings. It is also widely applied in the electronics, chemical, and instrumentation industries for observing both opaque and transparent substances.

 

 

| Service Products / Fields

 

According to the functional characteristics of components, acceptance standards generally include three conditions: ideal condition, acceptable condition, and reject condition. It is mainly applied to the inspection and verification of tooling gauges and metal parts, the detection of assembly deviations and soldering abnormalities in electronic products, and the inspection of PCB/PCBA circuitry, solder mask, holes, component alignment, as well as textual and graphical defects.

 

Testing Procedure:

Confirm sample type → Confirm inspection specification → Place the sample under the optical microscope for observation → Record observed phenomena → Evaluate results.

 

 

| MTT Advantages

 

1. Professional Team: A team of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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