
As a professional third-party laboratory specializing in materials and component inspection and analysis, MTT leverages years of expertise in testing and analytical work to assist R&D units in formulating quality evaluation programs for new materials and new processes. It also supports buyers in verifying the critical technical parameters of new materials against relevant standards or specifications, and issues authoritative testing and analysis reports.
| Project Background
The materials industry is a fundamental sector of the national economy, while new materials represent the leading edge of materials industry development and constitute an important strategic emerging industry. As one of the three key technologies of the 21st century, new materials serve as the “cradle” for the emergence of new technologies, new products, and new equipment across diverse fields. With the advent of new materials, it is indispensable to conduct analysis and evaluation of their properties, application domains, and value.
As a professional third-party laboratory specializing in materials and component inspection and analysis, MTT leverages years of expertise in testing and analytical work to assist R&D units in formulating quality evaluation programs for new materials and new processes. It also supports buyers in verifying the critical technical parameters of new materials against relevant standards or specifications, and issues authoritative testing and analysis reports.
| Service Products / Fields
1. New types of electronic information materials, such as high thermal conductivity/dissipation materials, printed circuit board materials, integrated circuit and semiconductor materials, and electronic auxiliary materials.
2. High-end metallic structural materials, such as high-quality specialty steels and high-strength advanced alloys.
Advanced polymer materials, including specialty rubbers, engineering plastics, functional membrane materials, high-performance platinum and silicon materials, as well as premium coatings.
3. New types of inorganic non-metallic materials, such as advanced ceramic materials, specialty glasses, synthetic crystals, superhard materials, and new electronic materials.
4. High-performance composite materials, including resin-based composites, carbon–carbon composites, ceramic-matrix composites, and metal-matrix composites.
5. Cutting-edge new materials, such as nanomaterials, biomaterials, smart materials, and superconducting materials.
| Test Method
Chemical composition analysis
Surface/interface morphology characterization and composition analysis
Mechanical/physical performance testing
Nondestructive structural analysis
Thermal performance/thermal parameter analysis
Electrical parameter test
Characterization of special parameters
Preparation of material specifications
| Testing Standards
Existing standards or mutually agreed testing methods, material specifications, etc.
| Test Method
1. Metal-based copper-clad laminate
Applicable standard: CPCA 4501—2010 Metal base copper clad laminate for printed circuits
Key parameters:
试验项目 Test items |
单位 Unit |
试验方法 GB/T 4722 Test method: GB/T 4722 |
要求 Requirements |
|||
LALA-01 |
LALB-01 |
LALC-01 |
LALD-01 |
|||
1. 热导率 1. Thermal conductivity (绝缘粘结层)λa (Insulating adhesive layer) λa |
W/(m.K) |
本标准附录A Appendix A of this standard |
λ≤1.0 |
1.0<λ≤1.5 |
1.5<λ≤2.0 |
2.0<λ≤3.0 |
2. 热阻a,不大于 2. Thermal resistance a, not greater than |
K.m2/W |
本标准附录A Appendix A of this standard |
2.0×10-4 |
1.0×10-4 |
0.7×10-4 |
0.5×10-4 |
3. 剥离强度, 不小于 A. 热应力后(288℃,10s) B. 高温下(125℃) 3. Peel strength, not less than A. After thermal stress (288℃, 10 s) B. At high temperature (125℃) |
N/mm |
16.4 16.9 |
1.05 0.7 |
1.05 0.7 |
1.05 0.7 |
1.05 0.7 |
4.燃烧性 4. Flammability (垂直燃烧法) a (Vertical burning method) a |
级 Grade |
26.5 |
FV-0 |
FV-0 |
FV-0 |
FV-0 |
5.热应力 5. Thermal stress (未蚀刻)(浮焊法), (Unetched) (solder float method), 288℃,120s |
- |
17 |
不分层、不起泡 No delamination, no blistering |
|||
6.玻璃化温度a 6. Glass transition temperature a (供选) (Optional) |
℃ |
本标准附录C Appendix C of this standard |
供需双方商定 To be determined by agreement between supplier and purchaser |
|||
7. 介电常数 7. Dielectric constant (A态)a(供选),1MHz (State A) a (optional), 1 MHz |
- |
本标准附录C Appendix C of this standard |
供需双方商定 To be determined by agreement between supplier and purchaser |
|||
8.介质损耗角正切值 8. Dissipation factor (loss tangent) (A态)a(供选),1MHz (State A) a (optional), 1 MHz |
- |
本标准附录C Appendix C of this standard |
供需双方商定 To be determined by agreement between supplier and purchaser |
|||
9. 体积电阻率 9. Volume resistivity (C-96/35/90),不小于 (C-96/35/90), not less than |
MΩ.cm |
本标准附录C Appendix C of this standard |
106
|
106
|
106
|
106
|
10.表面电阻率 10. Surface resistivity (C-96/35/90),不小于 (C-96/35/90), not less than |
MΩ |
本标准附录C Appendix C of this standard |
104
|
104
|
104
|
104
|
11.击穿电压 11. Dielectric breakdown voltage (垂直板面)a,不小于 (Vertical board surface) a, not less than A级 Class A B级 Class B C级 Class C |
kV |
本标准附录C Appendix C of this standard |
2 4 6 |
2 4 6 |
2 4 6 |
2 4 6 |
12. 相比电痕化指数 12. Comparative tracking index (CTI)a(供选) (CTI) a (optional) Ⅰ级 Class I, Ⅱ级 Class II, Ⅲ级 Class III |
V |
10 |
CTI≥600V 400V≤CTI<600V 175V≤CTI<400V |
|||
13. 吸水率a 13. Water absorption a |
% |
27 |
1.5 |
1.5 |
1.5 |
1.5 |
14.耐化学性 14. Chemical resistance (供选) (Optional) |
- |
本标准附录C Appendix C of this standard |
无起泡、无分层、外观无明显变化 No blistering, no delamination, and no significant change in appearance |
|||
15.冲切后热冲击 15. Thermal shock after punching (供选) (Optional) |
- |
本标准附录B Appendix B of this standard |
不分层、不起泡 No delamination, no blistering
|
2. Conductive silver paste
Inspection and evaluation basis: material specifications
Examples of key parameters:
1. Filler: Silver
2. Solid content (wt%): 60–75
3. Density (g/cm³): 2.5–3.0
4. Viscosity (CPS): 10,000–20,000 (NDJ viscometer, spindle 4#, 3 rpm @ 25℃)
5. Coating area (cm²/g) (depending on film thickness): 100–200
6. Sheet resistance (mΩ/□/25.4 μm): <12
7. Adhesion (3M600/810 tape, vertical pull): no detachment
8. Hardness: >2H
9. Flexibility: ΔR <2 Ω (conductor width 1 mm, subjected to 2 kg forward and reverse bending × 1 minute × 10 cycles)
10. Long-term operating temperature (℃): <120
3. Anti-corrosion materials
Inspection and evaluation basis: confirmed by both supplier and purchaser
Examples of key parameter requirements:
序号 No. |
项目 Item |
性能指标 Performance indicator |
测试方法 Test method |
1 |
基膜材料 Base film material |
聚乙烯片材 Polyethylene sheet |
- |
2 |
基膜颜色 Base film color |
黑色 Black |
- |
3 |
基膜厚度 mm Base film thickness, mm |
≥0.2 |
GB/T 6672 |
4 |
胶带总厚度 mm Total tape thickness, mm |
≥1.0 |
- |
5 |
基膜拉伸强度 MPa Base film tensile strength, MPa |
≥18 |
GB/T 13022 |
6 |
基膜断裂伸长率 % Base film elongation at break, % |
≥200 |
GB/T 13022 |
7 |
剥离强度N/cm, 对底漆钢a Peel strength, N/cm, against primed steel a |
≥20 |
GB/T 2792 |
剥离强度N/cm, 对背材 Peel strength, N/cm, against backing material |
≥20 |
GB/T 2792 |
|
8 |
电气强度 MV/m Dielectric strength, MV/m |
≥30 |
GB/T 1408.1 |
9 |
体积电阻率 Ω·m Volume resistivity, Ω·m |
≥1×1012 |
GB/T 1410 |
10 |
耐热老化b,% Thermal aging resistance b, % |
≥75 |
SY/T 0414附录A SY/T 0414 Appendix A |
11 |
吸水率 % Water absorption, % |
≤0.2 |
SY/T 0414附录B SY/T 0414 Appendix B |
12 |
水蒸汽渗透率mg/24h.cm2 Water vapor permeability, mg/24h·cm² |
≤0.45 |
GB/T1037 |
13 |
耐紫外光老化(600h)c, % UV aging resistance (600h) c, % |
≥80 |
GB/T 23257附录F GB/T 23257 Appendix F |