Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Evaluation Of New Materials/New Processes

As a professional third-party laboratory specializing in materials and component inspection and analysis, MTT leverages years of expertise in testing and analytical work to assist R&D units in formulating quality evaluation programs for new materials and new processes. It also supports buyers in verifying the critical technical parameters of new materials against relevant standards or specifications, and issues authoritative testing and analysis reports.

Evaluation Of New Materials/New Processes

| Project Background

 

The materials industry is a fundamental sector of the national economy, while new materials represent the leading edge of materials industry development and constitute an important strategic emerging industry. As one of the three key technologies of the 21st century, new materials serve as the “cradle” for the emergence of new technologies, new products, and new equipment across diverse fields. With the advent of new materials, it is indispensable to conduct analysis and evaluation of their properties, application domains, and value.

 

As a professional third-party laboratory specializing in materials and component inspection and analysis, MTT leverages years of expertise in testing and analytical work to assist R&D units in formulating quality evaluation programs for new materials and new processes. It also supports buyers in verifying the critical technical parameters of new materials against relevant standards or specifications, and issues authoritative testing and analysis reports.

 

 

| Service Products / Fields

 

1. New types of electronic information materials, such as high thermal conductivity/dissipation materials, printed circuit board materials, integrated circuit and semiconductor materials, and electronic auxiliary materials.

 

2. High-end metallic structural materials, such as high-quality specialty steels and high-strength advanced alloys.

Advanced polymer materials, including specialty rubbers, engineering plastics, functional membrane materials, high-performance platinum and silicon materials, as well as premium coatings.

 

3. New types of inorganic non-metallic materials, such as advanced ceramic materials, specialty glasses, synthetic crystals, superhard materials, and new electronic materials.

 

4. High-performance composite materials, including resin-based composites, carbon–carbon composites, ceramic-matrix composites, and metal-matrix composites.

 

5. Cutting-edge new materials, such as nanomaterials, biomaterials, smart materials, and superconducting materials.

 

 

| Test Method

 

Chemical composition analysis

Surface/interface morphology characterization and composition analysis

Mechanical/physical performance testing

Nondestructive structural analysis

Thermal performance/thermal parameter analysis

Electrical parameter test

Characterization of special parameters

Preparation of material specifications

 

 

| Testing Standards

 

Existing standards or mutually agreed testing methods, material specifications, etc.

 

 

| Test Method

 

1. Metal-based copper-clad laminate

Applicable standard: CPCA 4501—2010 Metal base copper clad laminate for printed circuits

Key parameters:

试验项目

Test items

单位

Unit

试验方法  GB/T 4722

Test method: GB/T 4722

要求

Requirements

LALA-01

LALB-01

LALC-01

LALD-01

1. 热导率

1. Thermal conductivity

(绝缘粘结层)λa

(Insulating adhesive layer) λa

W/(m.K)

本标准附录A

Appendix A of this standard

λ≤1.0

1.0<λ≤1.5

1.5<λ≤2.0

2.0<λ≤3.0

2. 热阻a,不大于

2. Thermal resistance a, not greater than

K.m2/W

本标准附录A

Appendix A of this standard

2.0×10-4

1.0×10-4

0.7×10-4

0.5×10-4

3. 剥离强度, 不小于

A. 热应力后(288℃,10s)

B. 高温下(125℃)

3. Peel strength, not less than

A. After thermal stress (288℃, 10 s)

B. At high temperature (125℃)

N/mm

16.4

16.9

1.05

0.7

1.05

0.7

1.05

0.7

1.05

0.7

4.燃烧性

4. Flammability

(垂直燃烧法) a

(Vertical burning method) a

Grade

26.5

FV-0

FV-0

FV-0

FV-0

5.热应力

5. Thermal stress

(未蚀刻)(浮焊法),

(Unetched) (solder float method),

288℃,120s

-

17

不分层、不起泡

No delamination, no blistering

6.玻璃化温度a

6. Glass transition temperature a

(供选)

(Optional)

本标准附录C

Appendix C of this standard

供需双方商定

To be determined by agreement between supplier and purchaser

7. 介电常数

7. Dielectric constant

A态)a(供选),1MHz

(State A) a (optional), 1 MHz

-

本标准附录C

Appendix C of this standard

供需双方商定

To be determined by agreement between supplier and purchaser

8.介质损耗角正切值

8. Dissipation factor (loss tangent)

A态)a(供选),1MHz

(State A) a (optional), 1 MHz

-

本标准附录C

Appendix C of this standard

供需双方商定

To be determined by agreement between supplier and purchaser

9. 体积电阻率

9. Volume resistivity

(C-96/35/90),不小于

(C-96/35/90), not less than

MΩ.cm

本标准附录C

Appendix C of this standard

 

106

 

 

106

 

 

106

 

 

106

 

10.表面电阻率

10. Surface resistivity

(C-96/35/90),不小于

(C-96/35/90), not less than

本标准附录C

Appendix C of this standard

 

104

 

 

104

 

 

104

 

 

104

 

11.击穿电压

11. Dielectric breakdown voltage

(垂直板面)a,不小于

(Vertical board surface) a, not less than

A级

Class A

B级

Class B

C级

Class C

kV

本标准附录C

Appendix C of this standard

2

4

6

2

4

6

2

4

6

2

4

6

12. 相比电痕化指数

12. Comparative tracking index

CTI)a(供选)

(CTI) a (optional)

Ⅰ级

Class I,

Ⅱ级

Class II,

Ⅲ级

Class III

V

10

CTI≥600V

400V≤CTI<600V

175V≤CTI<400V

13. 吸水率a

13. Water absorption a

%

27

1.5

1.5

1.5

1.5

14.耐化学性

14. Chemical resistance

(供选)

(Optional)

-

本标准附录C

Appendix C of this standard

无起泡、无分层、外观无明显变化

No blistering, no delamination, and no significant change in appearance

15.冲切后热冲击

15. Thermal shock after punching

(供选)

(Optional)

-

本标准附录B

Appendix B of this standard

 

不分层、不起泡

No delamination, no blistering

 

 

 

2. Conductive silver paste

Inspection and evaluation basis: material specifications

Examples of key parameters:

1. Filler: Silver

2. Solid content (wt%): 60–75

3. Density (g/cm³): 2.5–3.0

4. Viscosity (CPS): 10,000–20,000 (NDJ viscometer, spindle 4#, 3 rpm @ 25℃)

5. Coating area (cm²/g) (depending on film thickness): 100–200    

6. Sheet resistance (mΩ/□/25.4 μm): <12

7. Adhesion (3M600/810 tape, vertical pull): no detachment

8. Hardness: >2H

9. Flexibility: ΔR <2 Ω (conductor width 1 mm, subjected to 2 kg forward and reverse bending × 1 minute × 10 cycles)

10. Long-term operating temperature (℃): <120

 

3. Anti-corrosion materials

Inspection and evaluation basis: confirmed by both supplier and purchaser

Examples of key parameter requirements:

 

序号

No.

项目

Item

性能指标

Performance indicator

测试方法

Test method

1

基膜材料

Base film material

聚乙烯片材

Polyethylene sheet

-

2

基膜颜色

Base film color

黑色

Black

-

3

基膜厚度 mm

Base film thickness, mm

≥0.2

GB/T 6672

4

胶带总厚度 mm

Total tape thickness, mm

≥1.0

-

5

基膜拉伸强度 MPa

Base film tensile strength, MPa

≥18

GB/T 13022

6

基膜断裂伸长率 %

Base film elongation at break, %

≥200

GB/T 13022

7

剥离强度N/cm,

对底漆钢a

Peel strength, N/cm,

against primed steel a

≥20

GB/T 2792

剥离强度N/cm,

对背材

Peel strength, N/cm,

against backing material

≥20

GB/T 2792

8

电气强度  MV/m

Dielectric strength, MV/m

≥30

GB/T 1408.1

9

体积电阻率 Ω·m

Volume resistivity, Ω·m

≥1×1012

GB/T 1410

10

耐热老化b,%

Thermal aging resistance b, %

≥75

SY/T 0414附录A

SY/T 0414 Appendix A

11

吸水率  %

Water absorption, %

≤0.2

SY/T 0414附录B

SY/T 0414 Appendix B

12

水蒸汽渗透率mg/24h.cm2

Water vapor permeability, mg/24h·cm²

≤0.45

GB/T1037

13

耐紫外光老化(600h)c, %

UV aging resistance (600h) c, %

≥80

GB/T 23257附录F

GB/T 23257 Appendix F

 

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