Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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HBM ESD

MTT has multiple advantages, providing professional and highly compatible HBM and LU testing services, with flexible configuration and advanced monitoring functions, to assist product quality and provide professional and reliable testing support.

 
HBM ESD

| Project Overview

 

1. Human Body Model Electrostatic Discharge (HBM ESD) is the earliest established and most widely used simulated electrostatic testing model. HBM is the abbreviation for Human Body Model, which represents the human electrostatic discharge model. When a person accumulates static electricity on the body through walking on the ground, friction, or other factors, and then touches an IC, the static electricity from the human body is discharged into the contacted device. The HBM ESD model simulates situations in which a charged human body comes into contact with or approaches electrostatic discharge sensitive devices (ESDS), where the components may be damaged either by direct electrostatic discharge or by electrostatic fields.

 

2. Latch-up: Triggered by parasitic structures within an IC, causing the formation of a low-impedance path inside the chip, which leads to the persistence of high current. Even after the triggering conditions are removed, the high current continues to flow. Only by powering off can the device exit the latch-up (LU) state. Causes of latch-up triggering: excessive voltage, improper power management sequencing, electrostatic discharge (ESD), and similar factors.

 

 

| Test Objective

 

1. Simulate the discharge condition when a charged human body touches the device, to evaluate the device’s tolerance to electrostatic discharge (ESD).

 

2. Assess the device’s resistance to latch-up effects, preventing the formation of low-impedance paths within the device caused by overvoltage or overcurrent, which could otherwise result in damage or failure.

 

 

| Test Standard

 

1.ANSI/ESDA/JEDEC JS-001-2024  Human Body Model (HBM) Device Level、MIL-STD-883E、AEC Q100-002E;

2.JEDEC JESD78F.02-2023  IC Latch-Up Test - Minor Revision of JESD78F.01, December 2022.

 

 

| Service Products / Fields

 

1. HBM: Widely applied in automotive electronics, consumer electronics, industrial electronics, and other fields.

 

2. LU: High-reliability fields such as automotive electronics and aerospace.

 

 

| Project Advantages

 

 

1. Compatibility with multiple testing methods and standards.

 

2. Highly flexible biasing and pin configuration capabilities.

 

3. Advanced control and monitoring functions.

 

4. Leakage current or DC IV characteristic scanning.

 

 

 

| Test Principle Diagram

 

HBM

 

 

LU

 

 

 

 

 

 

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