
Tin whiskers are slender tin crystals that grow spontaneously on the surface of pure tin or tin alloy coatings. Their presence in electronic circuits may cause short-circuits, reduce the reliability of electronic devices, and even lead to the malfunction or failure of electronic devices.
| Project Overview
Tin whiskers are slender tin crystals that grow spontaneously on the surface of pure tin or tin alloy coatings. Their presence in electronic circuits may cause short-circuits, reduce the reliability of electronic devices, and even lead to the malfunction or failure of electronic devices. The tin whisker observation and analysis project aims to observe and analyze the growth of tin whiskers on tin-plated pins of components, tin-plated metal structural parts, tin pads on PCB boards, and lead-free solder joints on PCBA used in the electronic manufacturing process through a series of professional non-destructive testing, microscopic analysis and other means.
| Test Objective
Accelerated aging tests (normal temperature and humidity, high temperature, high temperature and high humidity, temperature shock, accelerated electrification, etc.) are carried out on products to accelerate the growth of tin whiskers, and the growth of tin whiskers is observed and evaluated under a scanning electron microscope.
| Testing Standards
JY/T 0584-2020、GB/T 16594-2008、JESD 201A-2008(R2014)。
| Service Products / Fields
The main test objects of this project include:
Tin-plated pins of components: The tin-plated pins on electronic components are one of the main areas where tin whiskers grow, and they need to be observed and analyzed intensively.
Tin-plated metal structural parts: In the electronic manufacturing process, tin whisker growth may also occur on the tin-plated metal structural parts used, and corresponding tests are required.
Tin pads on PCB boards: The tin pads on PCB boards are the key parts for connecting electronic components, and the growth of tin whiskers on them directly affects the performance and reliability of electronic products.
Lead-free solder joints on PCBA: With the advancement of the lead-free trend, lead-free solder joints on PCBA have become one of the important objects for tin whisker observation and analysis.
Typical pictures
Test requirements, dimension measurement diagram
| MTT Advantages
1. Professional Team: A team of highly experienced testing engineers and technical experts.
2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.
3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.
4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.