Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Transmission Electron Microscopy

Transmission Electron Microscopy (TEM) Testing: based on the wave properties of electron beams, a high-energy electron beam emitted from an electron gun is converged by a condenser lens to penetrate the specimen. It is then sequentially magnified by an electromagnetic lens system, including objective, intermediate, and projector lenses, and finally imaged on a fluorescent screen or recorded by an imaging system.

Transmission Electron Microscopy

| Project Overview

 

Transmission Electron Microscopy (TEM) Testing: based on the wave properties of electron beams, a high-energy electron beam emitted from an electron gun is converged by a condenser lens to penetrate the specimen. It is then sequentially magnified by an electromagnetic lens system, including objective, intermediate, and projector lenses, and finally imaged on a fluorescent screen or recorded by an imaging system.

 

Its remarkable advantages lie in the fact that it achieves a resolution of up to 0.05 nm, enabling the capture of atomic-level details; it offers magnification beyond one million times, thus realizing atomic-scale resolution; and, when combined with an energy dispersive spectrometer, it allows both qualitative and quantitative analysis of crystal structures, defect distributions, and elemental compositions. This technology supports research in materials science by elucidating the relationship between microstructures and properties of metals, semiconductors, and other materials; in life sciences, it enables the observation of cellular ultrastructures and viral morphology; and in physics, it provides critical experimental evidence for nanomaterials research.

 

Special sample preparation is required prior to testing: bulk samples are sectioned into ultra-thin slices of approximately 50 nm using an ultramicrotome; powder samples are suspended in a solvent and then dropped onto a supporting film; liquid samples are observed using a liquid cell holder equipped with a silicon nitride window.

 

 

| Test Objective

 

1. Observing microscopic morphology and structures: leveraging high resolution (up to 0.05 nm) and ultra-high magnification (over one million times), it allows the observation of nanoscale microstructures in materials and biological samples (such as crystal lattices, cellular organelles, and nanoparticle morphology), thereby revealing atomic-level arrangements and defect distributions.

 

2. Analyzing material composition and properties: in combination with attachments such as energy dispersive spectrometers, it enables qualitative and quantitative analysis of crystal structures and elemental compositions of samples, investigating the correlation between defects, dislocations, and material performance, or elucidating the spatial conformations of biological macromolecules.

 

3. Serving multidisciplinary research needs: in materials science, it guides the development of new materials; in life sciences, it explains disease mechanisms; and in physics, it provides experimental evidence for nanotechnology, thereby enabling correlation studies from microstructural features to macroscopic properties.

 

 

| Testing Standards

 

 GB/T 34002-2017 Microbeam analysis-Analytical transmission electron microscopy - Methods for calibrating image magnification by using reference materials having periodic structures

 

GB/T 18907-2013 Microbeam analysis - Analytical electron microscopy - Selected-area electron diffraction analysis using a transmission electron microscope

 

JB/T 9352-1999 Test method for the transmission electron microscope

 

 

| Service Products / Fields

 

Transmission electron microscopy is widely applied. In the field of materials science, it enables the study of microstructures in metals, ceramics, and other materials, thereby supporting new material development. In life sciences, it facilitates the observation of cellular and viral ultrastructures, aiding research into disease mechanisms. In the semiconductor industry, it is used for observing the atomic structure inside chips and for defect analysis, improving chip production yield, while also providing support for advancements in display technology.

 

 

| Project Advantages

 

High resolution: up to 0.05 nm, capable of capturing atomic-level microstructural details.

 

Ultra-high magnification: exceeding one million times, enabling atomic-level resolution imaging.

 

Multifunctional analysis: can be combined with energy dispersive spectrometers and other attachments to simultaneously analyze crystal structures, elemental compositions, and defect distributions.

 

Cross-disciplinary applicability: meeting microscopic research needs across multiple fields, including materials science, life sciences, and semiconductors.

 

Non-destructive/low-damage testing: for example, cryo-electron microscopy technology can reduce beam-induced damage to biological samples.

 

Dynamic observation capability: certain models allow real-time monitoring of in-situ dynamic processes (such as phase transitions and material growth).

 

 

| MTT Advantages

 

1. Professional Team: Equipped with a number of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

 

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