Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Dynamic Secondary Ion Mass Spectrometry

D-SIMS can provide elemental structural information of surfaces, thin films, interfaces, and even three-dimensional samples. 

Dynamic Secondary Ion Mass Spectrometry

| Project Overview

 

Dynamic Secondary Ion Mass Spectrometry (D-SIMS) is a highly sensitive surface analysis technique. It bombards the sample surface with primary ions to eject an extremely small quantity of secondary ions. The elemental species are then determined based on the mass of the secondary ions. This method is characterized by extremely high resolution and detection limits for surface analysis. D-SIMS can provide elemental structural information of surfaces, thin films, interfaces, and even three-dimensional samples. Its unique feature lies in the fact that secondary ions originate from a single atomic layer of the surface (within 1 nm), carrying only the surface chemical information. With advantages of small analytical area, shallow analytical depth, and high detection limits, it is widely applied in physics, chemistry, microelectronics, biology, pharmaceuticals, and spatial analysis for both industrial and research purposes.

 

 

| Test Objective

 

(1) When minute foreign substances are present on the product surface and conventional composition testing methods cannot accurately perform qualitative or quantitative analysis, D-SIMS can be selected. D-SIMS is capable of analyzing the composition of foreign particles with diameters ≥10 μm.

 

(2) When the surface film layer of a product is too thin for conventional methods to measure thickness, D-SIMS can be applied. With D-SIMS, ultrathin films with thicknesses ≥1 nm can be measured.

 

(3) When a product surface contains multiple thin film layers and it is necessary to measure the thickness and composition of each layer, D-SIMS can be applied to accurately determine both the thickness and the compositional content of each thin film.

 

(4) When issues such as delamination occur between the film layer and the substrate cross-section but no obvious traces of foreign matter are observed, D-SIMS can be used to analyze ultra-trace surface substances to determine whether external contamination exists in the cross-section, with a detection limit reaching the ppb level.

 

(5) In doping processes, the concentration of doped elements is generally within the ppm–ppb range, and the depth can reach tens of micrometers. Conventional methods cannot accurately measure the concentration distribution of doped elements from the surface to the core, whereas D-SIMS can successfully carry out this parameter testing.

 

 

| MTT Advantages

 

1. Professional Team: A team of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

 

Precautions for Dynamic Secondary Ion Mass Spectrometry (D-SIMS) Analysis

(1) The maximum sample size is 1 × 1 × 0.5 cm. If the sample size exceeds this specification, it shall be cut for testing, and the sample surface shall be flat.

(2) During sampling, avoid any contact between hands or tools and the test area. After the sample is removed, use vacuum packaging or other packaging that isolates it from the external environment to prevent contamination that could affect analytical results.

(3) Samples tested with D-SIMS are not restricted by conductivity; insulating samples can also be analyzed.

(4) The elemental analysis range of D-SIMS covers H to U, with detection limits reaching the ppb level.

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