Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Whole-Machine Failure Analysis

Whole-machine failure analysis is a specialized technical project aimed at conducting comprehensive fault investigation and analysis of complete electronic devices.

Whole-Machine Failure Analysis

| Project Overview

 

Whole-machine failure analysis is a specialized technical project aimed at conducting comprehensive fault investigation and analysis of complete electronic devices. This project employs advanced instruments such as high-performance oscilloscopes and high-precision, low-ripple, low-noise power supplies, combined with circuit theory and system analysis expertise, to carry out in-depth testing and analysis of failed whole-machine samples. Its purpose is to pinpoint the failure location, analyze failure modes and mechanisms, and ultimately determine the root cause of the failure.

 

 

 

 

| Test Objective

 

 

1. Pinpointing the failure location: by utilizing advanced testing equipment and technical methods, failure regions or components within the whole machine can be quickly and accurately located, whether on the circuit board or in other parts of the system.

 

2. Analyzing failure modes and mechanisms: by thoroughly investigating the manifestations and causes of whole-machine failures from multiple perspectives—including circuit principles, system architecture, and environmental influences—the underlying physical or chemical processes that lead to failure are revealed.

 

3. Identifying the root cause of failure: through a comprehensive analysis of testing data, circuit principles, and system information, the fundamental cause of the whole-machine failure is determined, thereby providing scientific evidence for subsequent corrective measures.

 

 

| Testing Standards

 

GJB 548C-2021

 

 

| Service Products / Fields

 

The whole-machine failure analysis project is widely applied across multiple product sectors, including communications, automotive electronics, household appliances, LED drivers, switch-mode power supplies, energy storage, and photovoltaic systems. In these fields, the whole machine represents the final product form of electronic equipment, where its reliability and stability are of critical importance. Once a failure occurs, it will directly impact product market performance and user satisfaction, and may even trigger serious safety incidents. Therefore, the whole-machine failure analysis project holds extremely high application value in these fields.

 

 

| Project Advantages

 

1. Comprehensive analysis: the whole-machine failure analysis project not only focuses on failures at the circuit board level but also covers other parts of the system, such as mechanical structures, thermal management systems, and power management, thereby delivering thorough failure analysis services.

 

2. Precise identification of root causes: by employing advanced testing equipment and technical methods in combination with system analysis knowledge, failures within the whole machine can be accurately pinpointed, and their root causes determined, providing strong support for subsequent corrective measures.

 

3. Enhancement of overall product reliability: through in-depth analysis of whole-machine failure modes and mechanisms, the project facilitates design optimization, process improvement, and system architecture enhancement, thereby improving the overall reliability and stability of the product.

 

4. Resolving after-sales issues: promptly and accurately identifying the root cause of whole-machine failures helps rapidly resolve after-sales problems, reduce customer complaint rates, and enhance both brand image and market competitiveness.

 

5. Laying the foundation for improvements: the whole-machine failure analysis project establishes a stable basis for subsequent product enhancements, production process optimization, or application expansion, thereby supporting the continuous growth and innovation of enterprises.

 

 

 

| MTT Advantages

 

1. Professional Team: Equipped with a number of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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