Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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PCB/PCBA Failure Analysis

By conducting failure analysis of PCB and PCBA failure phenomena, and through a series of analytical validations, the root causes and mechanisms of failures can be identified. This is of great importance for bettering product quality, improving production processes, and arbitrating failure-related disputes.


| Introduction

 

With the increasing density of electronic products and the adoption of lead-free manufacturing, the technical standards and quality requirements of PCB and PCBA products face severe challenges. This necessitates stricter control of processes and raw materials throughout PCB design, production, processing, and assembly. At present, since the industry is still in a phase of technological and process transformation, customers have varying levels of understanding of PCB fabrication and assembly processes. As a result, failures such as leakage, open circuits (in traces or vias), poor soldering, and board delamination frequently occur, often causing quality liability disputes between suppliers and users, which in turn lead to significant economic losses. By conducting failure analysis of PCB and PCBA failure phenomena, and through a series of analytical validations, the root causes and mechanisms of failures can be identified. This is of great importance for bettering product quality, improving production processes, and arbitrating failure-related disputes.

 

 

| Service Targets

 

1. Printed Circuit Board and Assembly (PCB & PCBA) Manufacturers: Confirm the quality status of products, analyze various issues arising in the production process, investigate the underlying mechanisms of problems, and provide reference opinions for improving product design and manufacturing processes.


2. Printed Circuit Board and Assembly (PCB & PCBA) Suppliers/Distributors: Control the quality of incoming goods, enhance user confidence in product usage, and strengthen brand value.

 

3. Printed Circuit Board Assembly (PCBA) System Integrators: Eliminate potential issues in the production process in a timely manner, improve the reliability of manufactured products, and reduce liability risks.

 


Types of PCB/PCBA Analyzed:


Rigid printed circuit boards, flexible printed circuit boards, rigid-flex boards, metal-based boards, ceramic-based boards.

Communication PCBA, lighting PCBA, consumer electronics PCBA, new energy vehicle PCBA, medical equipment PCBA, household appliance PCBA, etc.

 

 

 

| Significance of Failure Analysis

 

1. Assist manufacturers in understanding product quality status, analyzing and evaluating current processes, and optimizing product development plans and manufacturing processes.


2. Identify the root causes of failures in electronic assembly, provide effective on-site process improvement solutions for electronic assembly, and reduce production costs.


3. Improve product yield and operational reliability, reduce maintenance costs, and enhance corporate brand competitiveness.


4. Identify the party responsible for product failures, providing the basis for judicial arbitration.



 

| Primary Failure Modes Targeted (but not limited to)


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