Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Microscopic Metallographic Analysis

It is mainly used to examine the microscopic structure of metal materials and evaluate the quality of heat treatment.

Microscopic Metallographic Analysis

| Test Objective

 

It is mainly used to examine the microscopic structure of metal materials and evaluate the quality of heat treatment.

 

 

| Service Products / Fields

 

Cast iron, steel, copper alloys, aluminum alloys, magnesium alloys, nickel alloys, titanium alloys, etc.

 

 

| Testing Standards

 

Steel and iron:

GB/T 13298-1991 Metal - Inspection method of microstructure

GB/T 13299-1991 Steel - Determination of microstructure

GB/T 9441-2009 Metallographic test for spheroidal graphite cast iron

GB/T 7216-2009 Metallographic test for gray cast iron

GB/T 1299-2000 Alloy tool steels

GB/T 13320-2007 Metellographic grading atlas and assessing method for steel die forgings

GB/T 11354-2005 Determination of nitrided case depth and metallographic microstructure examination for steel and iron parts

GB/T 13305-2008 Micrographic method for determining area content of the α-phases in stainless steels

GB/T 4334-2008 Corrosion of metals and alloys - Test methods for intergranular corrosion of stainless steels

GB/T 14979-1994 Eutectic carbide of steel - Micrographic method using standard diagrams

JB/T 1255-2001 Specification for heat-treatment of rolling bearing parts made from high carbon chromium steel

JB/T 9204-2008 Metallographic examination of induction hardened steel parts

JB/T 7710-2007 Determination of microstructure for the thin layer carbonitriding or carburizing elements

JB/T 7713-2007 Metallographic examination method of high-carbon high-alloy cold-work tool steel

 

 

Copper and copper alloys:

QJ 2337-1992 Metallographic test method for beryllium bronze

 

 

Magnesium and magnesium alloys:

GB/T 4296-2004   Inspection method for microstructure of wrought magnestium alloy

 

 

Aluminum and aluminum alloys:

JB/T 7946.1-1999 Metallograph of cast aluminum alloys Cast aluminum-silicon alloys - Modification

JB/T 7946.2-1999 Metallograph of cast aluminum alloys Cast aluminum-silicon alloys - Burning

JB/T 7946.3-1999 Metallograph of cast aluminum alloys Cast aluminum-silicon alloys - Pinhole

JB/T 7946.4-1999 Metallograph of cast aluminum alloys Cast aluminum-silicon alloys - Grain size

 

 

| Typical Images

 

 

 

45钢金相组织

Metallographic structure of 45 steel

PMS钢金相组织

Metallographic structure of PMS steel

 

 

314不锈钢晶间腐蚀

Intergranular corrosion of 314 stainless steel

奥氏体双相不锈钢

Austenitic duplex stainless steel

 

 

铝合金金相组织

Metallographic structure of aluminum alloy

铜合金金相组织

Metallographic structure of copper alloy

 

 

 

| MTT Advantages

 

1. Professional Team: A team of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

 

Testing Procedure

Sampling → Cleaning → Embedding → Grinding → Polishing → Micro-etching → Observation.

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