Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Professional verification platform, delivering precise data insights to build a solid foundation of trust for investors.
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Time of Flight Secondary Ion Mass Spectrometry

TOF-SIMS is capable of providing elemental, molecular, and structural information of surfaces, thin films, interfaces, and even three-dimensional samples.

Time of Flight Secondary Ion Mass Spectrometry

| Project Overview

 

Time of Flight Secondary Ion Mass Spectrometry (TOF-SIMS) is an exceptionally sensitive surface analysis technique. It operates by bombarding the sample surface with primary ions, which ejects an extremely small quantity of secondary ions. The mass of these ions is then determined by measuring their different flight times to the detector, depending on their mass. This method provides a measurement technology with extremely high resolution. It can be widely applied in diverse industrial and research fields, including physics, chemistry, microelectronics, biology, pharmaceuticals, and spatial analysis.

TOF-SIMS is capable of providing elemental, molecular, and structural information of surfaces, thin films, interfaces, and even three-dimensional samples. Its distinctive feature lies in the fact that the secondary ions originate from a single atomic or molecular layer of the surface (within 1 nm), thus carrying only surface chemical information. With its advantages of small analytical area, shallow analytical depth, and non-destructive nature, TOF-SIMS is extensively used in physics, chemistry, microelectronics, biology, pharmaceuticals, and spatial analysis across both industrial and research domains.

 

 

| Test Objective

 

(1) When minute foreign substances are present on the product surface and conventional composition analysis methods cannot accurately identify and quantify them, TOF-SIMS can be employed. TOF-SIMS is capable of analyzing the composition of foreign particles with diameters ≥10 μm.

 

(2) When the surface coating of a product is too thin to allow conventional methods to carry out compositional analysis, TOF-SIMS may be chosen. This technique enables qualitative analysis of the composition of ultra-thin film layers.

 

(3) When foreign substances appear on the product surface but their type cannot be determined, TOF-SIMS compositional analysis can be applied. It not only identifies the elemental constituents of the foreign matter but also determines the molecular formulas, including organic molecular formulas, of the contaminants.

 

(4) When issues such as delamination occur between the coating and the substrate cross-section but no obvious traces of foreign matter are observed, TOF-SIMS can be utilized to analyze trace surface substances. This enables determination of whether external contamination exists within the cross-section, with a detection limit as high as the ppm level.

 

 

| MTT Advantages

 

1. Professional Team: A team of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

 

 Precautions for Time-of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS) Analysis

 

(1) The maximum sample size is 1 × 1 × 0.5 cm. If the sample exceeds this size, it shall be cut prior to testing.

(2) During sampling, avoid any contact between hands or tools and the test area. After the sample is removed, use vacuum packaging or other packaging that isolates it from the external environment to prevent contamination that could affect analytical results.

(3) Samples for TOF-SIMS testing are not restricted by conductivity; even insulating samples can be tested.

(4) The elemental analysis range of TOF-SIMS extends from H to U, covering both organic and inorganic elements as well as molecular states, with a detection limit at the ppm level.

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