Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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TMA Test

通过高精度追踪尺寸-温度-时间-载荷的耦合关系,TMA将材料的热机械行为转化为工程化参数,是解决热应力失效、优化热加工工艺的关键实验依据。TMA在解决热应力失效、工艺临界点控制、多材料系统匹配性问题上具有不可替代性。

TMA Test

| Project Background

 

By precisely tracking the coupled relationship among size, temperature, time, and load, TMA converts the thermomechanical behavior of materials into engineering parameters, which serves as a crucial experimental basis for solving thermal stress failure problems and optimizing thermal processing technologies. TMA is irreplaceable in solving problems related to thermal stress failure, process critical-point control, and the compatibility of multi-material systems.

 

 

| Project Overview

 

The basic principle of the thermomechanical analyzer (TMA) technology is to measure the deformation of a sample during a certain load and temperature program (heating/cooling/constant temperature and their combinations). The following characteristics of materials can be studied using a thermomechanical analyzer:

1. Linear expansion and contraction

2. Glass transition temperature

3. Densification and sintering processes

4. Optimization of heat treatment processes

5. Softening point detection

6. Phase transition processes

7. Research on reaction kinetics.

 

 

| Test Objective

 

1. Quantification of thermal expansion behavior;

2. Phase transformation and transition temperature;

3. Softening and deformation properties.

 

 

| Testing Standards

 

ISO 11359 series Plastics - Thermomechanical analysis (TMA)

ASTM E831 Standard test method for linear thermal expansion of solid materials by TMA

IPC TM-650 2.4.24 Glass transition temperature and coefficient of thermal expansion in the Z-axis by TMA

 

 

| Service Products / Fields

 

Consumer electronics, automotive electronics, electronic manufacturing, PCB design and materials science, aerospace, electronic packaging, new-energy electronics, etc.

 

 

| MTT Advantages

 

1. Professional Team: Equipped with a number of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results. High-precision dimensional measurement capability, multi-dimensional simulation of real scenarios, more sensitive to the glass transition of highly cross-linked/filled systems, support for testing under constant load to approximate actual working conditions, and wide temperature range applicability.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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