| Project Background

As electronic devices develop towards high density and high power, the heat dissipation capacity of PCBs has become the core bottleneck restricting the reliability of the system. The thermal conductivity of traditional FR-4 substrates is relatively low, which cannot meet the requirements of chip junction temperature control; The application of new thermal conductive materials such as metal substrates (e.g., aluminum substrates) and ceramic-filled substrates urgently requires accurate quantification of their longitudinal (Z-axis) and transverse (X/Y-axis) thermal conductive properties to provide a data foundation for thermal design.

| Project Overview

This test uses the steady-state heat flow method and the transient laser method to measure the thermal conductivity of PCBs.

Steady-state heat flow method: Apply a certain heat flux and pressure to the sample, measure the thickness of the sample and the temperature difference between the hot board and the cold board, to obtain the thermal conductivity of the sample.

Transient laser method: Under the control of the programmed temperature, a laser source emits a light pulse instantaneously, which uniformly irradiates the lower surface of the sample. After the surface layer of the sample absorbs the light energy, the temperature rises instantaneously, and this surface serves as the hot end to transmit energy to the cold end (upper surface) in a one-dimensional heat conduction manner. Use an infrared detector to continuously measure the corresponding temperature rise process at the center of the upper surface, obtain the relationship curve of temperature rise versus time, and calculate the required parameters.

| Test Objective

1. Quantify thermal conductive performance;

2. Support for material selection;

3. Process optimization.

| Testing Standards

ASTM E1461 Standard test method for thermal diffusivity by the flash method

ISO 22007-4 Plastics - Determination of thermal conductivity and thermal diffusivity - Part 4: Laser flash method

GB/T 22588 Measurement of thermal diffusivity or thermal conductivity by the flash method

ASTM D5470 Test method for thermal transmission properties of thin thermally conductive solid electrical insulation materials

| Service Products / Fields

Consumer electronics, automotive electronics, electronic manufacturing, PCB design and materials science, aerospace, communications, new-energy electronics, etc.

| MTT Advantages

1. Professional Team: Equipped with a number of highly experienced testing engineers and technical experts.

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results. Accurate and efficient, fast testing, capable of extreme environment simulation, and broadly applicable.

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.