Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Nanoindentation/Nanohardness

The nanoindenter is primarily used for testing the hardness and Young’s modulus of thin-film materials at the micro- and nanoscale. The test results are derived from the load–displacement curve, eliminating the need for microscopic observation of the indentation area. 

Nanoindentation/Nanohardness

| Project Overview

 

Principle: A minute diamond indenter is pressed into the material at the nanoscale to obtain critical mechanical parameters such as hardness and elastic modulus.

 

Advantage: It offers high spatial resolution and the capability of direct measurement, making it suitable for analytical testing of organic or inorganic, soft or hard materials.

 

 

| Project Objective

 

The nanoindenter is primarily used for testing the hardness and Young’s modulus of thin-film materials at the micro- and nanoscale. The test results are derived from the load–displacement curve, eliminating the need for microscopic observation of the indentation area. It is particularly suitable for measuring the mechanical properties of ultrathin materials such as films and coatings. At the nanoscale, it can characterize mechanical behaviors including load–displacement curves, elastic modulus, hardness, fracture toughness, strain-hardening effects, viscoelasticity, or creep behavior.

 

 

| Project Overview

 

Detection of red phosphorus content in products to ensure compliance with international environmental protection and health standards. As a key phosphorus-based flame retardant, red phosphorus is widely used across various industries. However, due to its environmental and health risks, global buyers and enterprises in regions such as Europe, the United States, Japan, and South Korea strictly regulate its use. Accurate quantification is performed through methods such as ICP-OES, PY-GC/MS, and GC-MS, thereby supporting product safety and regulatory compliance.

 

 

| Test Standard

 

GB/T 22458、GB/T 21838.1

 

 

| Service Products / Fields

 

It is widely applied in materials science, nanotechnology, the semiconductor industry, and the field of biomedicine, enabling precise measurement of material mechanical properties at the micro- and nanoscale.

 

 

| Project Advantages

 

With precise control and testing bandwidth, it provides outstanding flexibility, applicability, sensitivity, and measurement reliability. Equipped with quantitative nanoindentation and microindentation, nanoscratch testing, nanotribology and wear analysis, high-resolution in-situ Scanning Probe Microscopy (SPM) imaging, dynamic nanoindentation, and high-speed performance imaging, it enables a comprehensive understanding of nanoscale material behaviors.

 

1. Professional Team: Equipped with a number of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Services: Rapidly responding to customer needs and providing one-stop testing services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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