Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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X-ray Photoelectron Spectroscopy

X-ray Photoelectron Spectroscopy (XPS) is a surface analysis method in which a sample is irradiated with X-rays, causing the excitation and emission of inner-shell or valence electrons from atoms or molecules. The electrons emitted through photon excitation are called photoelectrons. By measuring the energy and quantity of these photoelectrons, the composition of the material under investigation can be determined. 

X-ray Photoelectron Spectroscopy

| Project Overview

 

X-ray Photoelectron Spectroscopy (XPS) is a surface analysis method in which a sample is irradiated with X-rays, causing the excitation and emission of inner-shell or valence electrons from atoms or molecules. The electrons emitted through photon excitation are called photoelectrons. By measuring the energy and quantity of these photoelectrons, the composition of the material under investigation can be determined. The primary application of XPS is to determine the binding energy of electrons in order to identify the chemical properties and composition of a sample surface. Its characteristic feature lies in the fact that photoelectrons originate from within 10 nm of the surface, carrying only surface chemical information. With advantages such as small analytical area, shallow analysis depth, and non-destructive measurement, it is widely applied to the study of metals, inorganic materials, catalysts, polymers, coating materials, and ores, as well as to research involving processes such as corrosion, friction, lubrication, adhesion, catalysis, coating, and oxidation.

 

 

| Test Objective

 

(1) When minute foreign substances are present on the product surface and conventional composition testing methods cannot accurately perform qualitative and quantitative analysis, XPS may be selected. XPS can analyze the composition of foreign particles with diameters ≥10 μm and determine their elemental valence states, thereby identifying the chemical state of the contaminants and providing precise data for failure mechanism analysis.

(2) When the surface film layer of a product is too thin for conventional methods to measure thickness, XPS can be employed. By using the depth sputtering function of XPS, film thicknesses ≥20 nm can be measured.

(3) When a product surface contains multiple thin film layers and it is necessary to measure the thickness and composition of each layer, D-SIMS can be applied to accurately determine both the thickness and the compositional content of each thin film.

(4) When substances containing multiple valence states of the same element exist on the product surface, and conventional testing methods cannot distinguish the proportions of the different valence states, XPS valence state analysis can be considered to determine the relative proportions of each valence state of the element.

 

Precautions for X-ray Photoelectron Spectroscopy (XPS) Analysis

 

(1) The maximum sample size is 1 × 1 × 0.5 cm. If the sample exceeds this size, it shall be cut prior to testing.

(2) During sampling, avoid any contact between hands or tools and the test area. After the sample is removed, use vacuum packaging or other packaging that isolates it from the external environment to prevent contamination that could affect analytical results.

(3) Samples for XPS testing may be sputter-coated with a thin layer of gold (≤1 nm) to allow testing of samples with weak conductivity; however, insulating samples cannot be analyzed.

(4) The elemental analysis range of XPS covers Li to U. It is limited to testing inorganic substances and cannot analyze organic materials, with a detection limit of 0.1%.

 

 

| MTT Advantages

 

1. Professional Team: Equipped with a number of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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