Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Reproduction Test

Reproduction testing is a specialized technical project designed to simulate and reproduce failure modes of electronic products or devices under specific conditions. 

Reproduction Test

| Project Overview

 

Reproduction testing is a specialized technical project designed to simulate and reproduce failure modes of electronic products or devices under specific conditions. This project employs advanced equipment such as high-performance, high-precision programmable high-power DC power supplies and electronic loads to set different voltage and current modes, reproducing the failure modes of samples and analyzing their root causes in depth. It provides critical support for product R&D, manufacturing, and after-sales problem resolution.

 

 

| Project Objective

 

1. Reproduce Sample Failure Modes:

By using high-performance testing equipment, precisely simulate the voltage and current conditions that samples may encounter in actual applications, reproduce their failure modes, and conduct detailed analysis.

 

2. Simulate Sample Failure Scenarios:

By configuring different testing parameters, simulate failures of samples under various extreme conditions, observe and record the failure process, and provide data support for subsequent analysis.

 

3. Identify the Root Causes of Sample Failure:

Conduct an in-depth analysis of the reproduced failure modes, and in combination with circuit principles and test data, identify the fundamental causes of sample failure, thereby providing a scientific basis for corrective measures.

 

 

| Test Standard

 

GJB 548C-2021

 

 

| Service Products / Fields

 

The reproduction testing project is widely applied in multiple product fields, including communications, automotive electronics, household appliances, LED drivers, switch-mode power supplies, energy storage, and photovoltaics. In these fields, product reliability and stability are crucial for user experience and market competitiveness. Through reproduction testing, potential product failure risks can be identified in advance, providing valuable reference for product research and development as well as manufacturing, and ensuring reliability and stability in real-world applications.

 

 

| Project Advantages

 

1. Accurate Reproduction of Failure Modes:

By utilizing high-performance testing equipment, sample failure modes can be precisely reproduced, thereby providing accurate data support for subsequent analysis.

 

2. In-Depth Analysis of Root Causes:

By combining circuit principles and test data, conduct a thorough analysis of failure root causes, offering a scientific foundation for corrective actions and contributing to enhanced product reliability and stability.

 

3. Supporting R&D and Manufacturing:

The reproduction testing project provides essential feedback for product research and development as well as production, helping to optimize product design, improve manufacturing process levels, and reduce the risk of product failure.

 

4. Timely Resolution of After-Sales Issues:

Through reproduction testing, after-sales issues can be quickly located and resolved, thereby reducing customer complaint rates, enhancing brand image, and strengthening market competitiveness.

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