Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Electronic Component Failure Analysis

MTT possesses profound technical expertise in electronic component failure analysis, complete analytical methodologies, a vast database of failure analysis cases, and a team of seasoned experts, enabling us to provide high-quality and efficient failure analysis services.


| Introduction

 

The rapid advancement of electronic component technologies and improvements in their reliability have laid the foundation for modern electronic equipment. The fundamental task of component reliability work is to enhance the reliability of the components themselves. Therefore, it is essential to emphasize and accelerate the development of reliability analysis for components. By analyzing and identifying failure mechanisms, pinpointing failure causes, and feeding this knowledge back to design, manufacturing, and usage processes, corrective measures can be jointly studied and implemented to improve the reliability of electronic components.

 

 

| Service Targets

 

Component manufacturers: deeply engaged in stages such as product design, production, reliability testing, and after-sales support, providing customers with theoretical foundations for improving product design and processes.

Assembly plants: responsible for assigning liability and providing a basis for claims; improving production processes; screening component suppliers; enhancing testing technologies; and optimizing circuit design.

Device agents: responsible for distinguishing quality liabilities and providing a basis for claims.

End-product users: provide evidence for improving operating environments and procedures, enhance product reliability, establish corporate brand image, and strengthen product competitiveness.

 

 

| Significance of Failure Analysis

 

1. Provide the foundation for design and process improvements of electronic components, guiding the direction of reliability work.

2. Identify the root causes of electronic component failures and effectively propose and implement reliability improvement measures.

3. Improve product yield and operational reliability, thereby enhancing the enterprise’s core competitiveness.

4. Clearly define the party responsible for product failures, providing a basis for judicial arbitration.

 

Types of analyzed components:

Integrated circuits, field-effect transistors, diodes, light-emitting diodes, transistors, thyristors, resistors, capacitors, inductors, relays, connectors, optocouplers, crystal oscillators, and various active/passive components.

 

 

| Primary Failure Modes (but not limited to)

 

Open circuits, short circuits, burnout, leakage, functional failure, electrical parameter drift, and unstable failures.


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