Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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ECM/CAF Test

It can detect in advance the failure risks caused by short-circuits or electrical leakage between metal conductors, ensuring the electrical safety of products. At the same time, it evaluates the cleanliness of PCBs and the reliability of auxiliary materials, preventing early failures caused by contamination or material defects, which is of crucial significance for improving the quality and long-term stability of electronic products.

ECM/CAF Test

| Project Background

 

ECM (Electrochemical Migration) and CAF (Conductive Anodic Filament) are common failure modes in printed circuit boards (PCBs), which may lead to circuit short-circuits, performance degradation, and even equipment malfunctions. With the miniaturization and high-performance development of electronic products, the density and complexity of PCBs are constantly increasing, and the ECM/CAF problems are becoming increasingly prominent. To ensure the reliability and safety of PCB products, ECM/CAF testing has become an indispensable testing step in fields such as electronic manufacturing, automotive electronics, and aerospace.

 

 

| Definitions and Hazards of ECM/CAF

 

Definition of ECM:

ECM, or Electrochemical Migration, refers to the growth phenomenon of conductive metal filaments on printed wiring boards (PWBs) under DC voltage, which may occur on the outer surface, interface, or structure of the material, and is usually dominated by the migration of ions such as Cu, Ag, and Sn.

 

 

Definition of CAF:

CAF, or Conductive Anodic Filament, is a form of ECM, specifically referring to the conductive filament phenomenon that occurs inside the PCB, and the migrating ions are mainly Cu ions.

 

Hazards:

ECM/CAF can cause short-circuits in PCB circuits, functional failures, and even pose safety hazards such as fires. In critical fields such as automotive and aerospace, ECM/CAF problems may lead to serious consequences.

 

 

| Test Objective

 

1. Improve the circuit board design or layout;

2. Improve the cleaning materials or processes;

3. Change the flux and/or solder paste;

4. Use new conformal coatings or processes;

5. Evaluate the qualifications of bare board suppliers;

6. Product calibration based on reliability;

7. Change the reflow soldering or wave soldering process.

 

 

| Test Principle and Formation Conditions

 

Test Principle:

The ECM/CAF test simulates a humid environment and applies a DC voltage to prompt the metal ions in the PCB to migrate under the action of an electric field and form conductive filaments.

 

Formation Conditions:

The formation of ECM/CAF requires conditions such as a humid environment, ion residues, an electric field, and migration channels. Among them, the humid environment is an essential medium for corrosion, ion residues accelerate the speed of corrosion and migration, the electric field provides the driving force for migration, and the migration channels allow ion migration.

 

 

 

 

 

 

 

 

| Service Products / Fields

 

Service Objects:

It includes materials and products such as solder paste, flux, cleaning agent, three-proof paint, and PCB.

 

 

| MTT Advantages

 

Provide comprehensive ECM/CAF testing services, including testing methods, equipment, processes, etc.

 

Have a professional technical team and rich testing experience, and can provide customers with accurate test results and solutions.

 

The test results are scientific and authoritative, and can provide strong support for customers' product improvement and optimization.

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