Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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PCB Physical Property Test

IPC-A-610 is a globally recognized acceptance standard for electronic assembly, used to regulate the quality of electronic products. It covers all aspects of electronic assembly and provides guidelines to ensure product performance and reliability.

PCB Physical Property Test

| Project Background

 

 

IPC-A-610 is a globally recognized acceptance standard for electronic assembly, used to regulate the quality of electronic products. It covers all aspects of electronic assembly and provides guidelines to ensure product performance and reliability.

 

 

| Project Overview

 

Physical property testing of printed boards (usually referring to printed circuit boards, PCBs) refers to various tests on their physical properties and material characteristics. These tests are crucial for ensuring the quality, reliability of PCBs and meeting specific application requirements. The following are some key physical property testing items and their significance:

 

Board peel strength: Measures the bonding strength between the copper foil and the substrate. The test is usually conducted under normal conditions, after thermal stress (such as after dip soldering), or after chemical treatment.

 

Moisture absorption rate: Measures the degree to which the material absorbs moisture. A high moisture absorption rate may lead to board popping (delamination) during soldering, a decrease in electrical performance (such as an increase in the loss tangent), and reliability issues.

 

Bending strength/flexibility: Evaluates the bending resistance of rigid boards; evaluates the bending life of flexible boards.

 

Adhesion test: Tests the bonding strength between the solder mask ink, character ink and the substrate or copper surface (usually using the tape method).

 

 

| Test Objective

 

1. Ensure reliability: Predict the long-term lifespan and failure risks of PCBs in the usage environment (temperature, humidity, vibration, chemicals, etc.) of the final product.

 

2. Meet process requirements: Ensure that PCBs can withstand subsequent assembly processes (such as SMT reflow soldering and wave soldering) without damage.

 

3. Comply with specifications and standards: Meet customer requirements, industry standards (such as IPC standards), and safety certifications (such as UL).

 

4. Quality control: Serve as a key quality control point in the production process.

 

5. Problem diagnosis: When a PCB fails, physical property testing is an important means to analyze the root cause.

 

 

| Testing Standards

 

 

IPC-4101: Specification for base materials for rigid and multilayer PCBs.

 

IPC-TM-650: Test Methods Manual (including detailed procedures for most of the above-mentioned test methods).

 

IPC-6012: Qualification and performance specification for rigid PCBs.

 

IPC-A-600: Acceptability of PCBs.

 

 

| Service Products / Fields

 

Consumer electronics, automotive electronics, communication equipment, medical electronics, aerospace/military.

 

 

| MTT Advantages

 

1. Professional Team: Equipped with a number of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results. Screen high-cost-effective substrates, identify process defects, and design risk avoidance to detect layout problems in advance.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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