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Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Solder Joint Reliability
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Bending Test
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Shear Test
硬度测试
Compression Test
Advanced Material Characterization
Destructive physical Analysis
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Peel Strength Test

Peel strength refers to the force required to peel the bonded materials per unit width from the contact surface. The peeling angle is 90 degrees or 180 degrees, and the unit is Newton per meter (N/m). It reflects the bonding strength of the material.

Peel Strength Test

| Project Overview

 

Peel strength refers to the force required to peel the bonded materials per unit width from the contact surface. The peeling angle is 90 degrees or 180 degrees, and the unit is Newton per meter (N/m). It reflects the bonding strength of the material.

 

 

| Example of Testing Items

 

Tape peel strength (90° peel strength, 180° peel strength)

 

Test Standards:

GB/T 2792-2014 Measurement of peel adhesion properties for adhesive tapes

 ASTM D1000-17 Test methods for pressure-sensitive adhesive tapes for electrical and electronic equipment

 ASTM D3330/D3330M-04(2018) Test method for peel adhesion of pressure-sensitive tapes

Sample requirements: At least 5 pieces of single 25×300mm tapes or a whole roll of tape

Experiment purpose: Through the peel strength test, accurate results can be obtained, to judge whether a certain tape can meet specific usage requirements or determine which factors may affect the adhesion of the product and avoid them.

 

 

 

Example of testing items: Peel strength test (Copper clad laminate, PCB)

Test Standards: ①: GB/T 4722-2017 7.2

  ②：IPC-TM-650 2.4.8C 

  ②: IPC-TM-650 2.4.8C 

Sample requirements:

①: The length of the copper foil > 75 mm, the width ≥ 0.8 mm, and there should be no less than 4 strips

 ②: 50.8 × 50.8 mm, at least 2 samples for each condition

Experimental purpose: The peel strength test of copper-clad laminates refers to the pulling force required to peel the copper foil of unit width from the substrate. By testing the adhesion between the metal layer of unit width and the substrate, the bonding force between layers in the material composed of surface materials and adhesives is determined.

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Shear/Torsion Test Microscopic Metallographic Analysis Wear Test High-Temperature Mechanics Surface Roughness Non-metallic inclusions
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