Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Principal Component Analysis

The qualitative analysis of polymer materials stems from the demand for rapid and accurate identification of the components of unknown materials in industrial practice: in reverse engineering, the type of matrix resin is unknown; in the production process, there is a risk of adulteration by suppliers; for environmental compliance, trace harmful additives need to be screened .

Principal Component Analysis

| Project Background

 

The qualitative analysis of polymer materials stems from the demand for rapid and accurate identification of the components of unknown materials in industrial practice: in reverse engineering, the type of matrix resin is unknown (such as special engineering plastics in competing products); in the production process, there is a risk of adulteration by suppliers (such as HIPS being used to impersonate ABS, leading to component cracking); for environmental compliance, trace harmful additives need to be screened (such as brominated flame retardants prohibited by RoHS).

 

 

| Project Overview

 

This test is mainly carried out through Fourier transform infrared spectroscopy (FTIR) and pyrolysis gas chromatography-mass spectrometry (PYGCMS). Fourier transform infrared spectroscopy (FTIR): It is good at qualitative analysis of polymer functional groups and is sensitive to the main organic components (resin type). Pyrolysis gas chromatography-mass spectrometry (PYGCMS): It is good at providing molecular information of pyrolysis products and has strong ability to identify resin types and additives (especially small-molecule additives and flame retardants). If special polymer materials are encountered, data from DSC and other methods may also be needed for verification.

 

 

| Test Objective

 

1. Understanding raw material components and conducting quality control;

 

2. Reverse analysis;

 

2. Research and development innovation;

 

3. Failure analysis and root-cause tracing, etc.

 

 

| Testing Standards

 

GB/T 6040 General rules for infrared spectral analysis methods

 

SN/T5689 Identification of plastic polymers - Pyrolysis gas chromatography-mass spectrometry

 

 

| Service Products / Fields

 

Rubber, plastics, adhesives, fine chemicals, coatings and inks, electronic packaging, welding processes, etc.

 

 

| Project Advantages

 

1. Full coverage of components, enabling the establishment of a product database for easy quality control;

 

2. Efficient, rapid, and minimally invasive detection. FTIR is nearly non-destructive; Py-GC/MS only requires a milligram-level sample, which is friendly to precious failed parts.

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