Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Professional verification platform, delivering precise data insights to build a solid foundation of trust for investors.
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Industrial CT

Industrial CT technology can accurately and quickly reproduce the three-dimensional structure inside an object, providing quantitative information on the physical and mechanical properties inside the object, such as the location and size of defects, changes in density and level, the shape and precise size of irregular structures, impurities and distribution inside the object, etc.

Industrial CT

| What is Nondestructive Testing (NDT)?

 

Nondestructive testing refers to a method that, without impairing the performance of the object under test or damaging its internal structure, examines and evaluates the internal and surface structures, properties, conditions, and defects of the specimen. It does so by detecting changes in responses such as heat, sound, light, electricity, or magnetism caused by abnormalities or defects in the material’s internal structure. This enables inspection of the type, quantity, shape, location, and size of defects.

 

 

| The Significance of Nondestructive Testing

 

Without damaging the tested object, these measurements help enterprises gain a more comprehensive, direct, and in-depth understanding and evaluation of the properties, conditions, quality, or internal structure of the inspected materials and equipment components. This contributes to monitoring product quality and improving manufacturing processes.

 

 

| Service Products / Fields

 

PCB & PCBA, FPC, electronic and electrical products, electronic components, plastic materials, automotive materials and parts, medical devices, academic/research products, military and defense applications, and more.

 

 

| CT Project Overview

 

CT technology can accurately and rapidly reconstruct the three-dimensional internal structure of objects. It quantitatively provides physical and mechanical characteristics of the internal structure, such as the location and size of defects, density variations and levels, shapes and precise dimensions of irregular structures, as well as internal impurities and their distribution.

 

 

| Project Objective

 

1. Rapidly, accurately, and intuitively identify internal defects of products (including defect types, locations, and dimensions), such

 

2. Through CT scanning, the internal structure of the product can be directly observed, enabling measurement of structural dimensions without damaging the sample. Its structural dimensions can thus be determined.

 

3. CT scanning allows the scan results to be optimally matched with CAD models, using intuitive color deviation maps. These highlight, quickly and vividly, the differences between the target structure and the CAD data.

 

4. Through CT scanning, the scan results can be exported as point cloud data and quickly output in STL file format for CAD applications.

 

 

| Testing Standards

 

VW50093, PV6093, and others.

 

 

| Service Products / Fields

 

Automotive materials and components, metallic materials, plastic materials, molds, rail transit, electronic and electrical products, medical devices, aerospace, research institutes, and defense industry.

 

 

| Testing Procedure

 

Confirm sample type/material → place into measuring device → rapid scanning → overall imaging and arbitrary sectional views → defect analysis.

 

 

 

| Typical Images

 

 

 

Inner layer defects of PCB

Internal defects of ceramic capacitors

 

 

Inspection of welding quality

BGA solder ball cold solder joint

 

 

 

| MTT Advantages

 

1. Professional Team: A team of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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