Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Professional verification platform, delivering precise data insights to build a solid foundation of trust for investors.
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X-ray Diffraction

X-ray Diffraction (XRD) Technology. By subjecting materials to X-ray diffraction and analyzing the diffraction patterns, this research method obtains information on material composition as well as the structure and morphology of atoms or molecules within the material. 

X-ray Diffraction

| Project Overview

 

X-ray Diffraction (XRD) Technology. By subjecting materials to X-ray diffraction and analyzing the diffraction patterns, this research method obtains information on material composition as well as the structure and morphology of atoms or molecules within the material. X-ray diffraction analysis is one of the primary methods for studying the phase composition and crystal structure of substances. When a substance (crystalline or amorphous) undergoes diffraction analysis, irradiation by X-rays produces varying degrees of diffraction. The composition, crystal form, bonding patterns within molecules, molecular configuration, and conformation determine the unique diffraction pattern characteristic of the substance. X-ray diffraction offers advantages such as non-destructive testing, absence of contamination, rapid analysis, high measurement accuracy, and the ability to obtain extensive information regarding crystal integrity. Therefore, as a modern scientific method for analyzing material structure and composition, X-ray diffraction analysis has been increasingly and widely applied in research across various disciplines as well as in industrial production.

 

 

| Test Objective

 

(1) When a material is composed of multiple crystalline components and it is necessary to distinguish the proportion of each component, the phase identification function of XRD can be used to analyze the relative proportions of the crystalline phases.

 

(2) The performance of many materials is determined by their degree of crystallinity. XRD crystallinity analysis can be employed to determine the crystallinity of a material.

 

(3) The development of new materials requires a thorough understanding of lattice parameters. XRD can rapidly measure lattice parameters, providing performance verification indicators for the development and application of new materials.

 

(4) When products exhibit failures such as fracture or deformation during use, these may be related to the influence of microscopic stress. XRD can be used to rapidly measure microstress.

 

(5) Due to their very small particle size, nanoparticles are prone to agglomeration, and the use of conventional particle size analyzers often results in inaccurate data. By applying the X-ray diffraction line broadening method (Scherrer method), the average particle size of nanoparticles can be determined.

 

 

| Application Example

 

Sample Information: The submitted test sample was a white powder identified as pearl powder, and the client requested phase identification. This test was conducted using a Rigaku D/max 2500 X-ray diffractometer.

 

Test Parameters: Tube voltage 40 kV, tube current 200 μA, Cu target, diffraction slit width DS = SS = 1°, RS = 0.3 mm, scanning speed 2.000 (°·min¹), scanning range 10°–80°.

 

| Test Spectrum

 

 

 

Test Results: The main component of the sample was identified as calcium carbonate.

 

 

| MTT Advantages

 

1. Professional Team: A team of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

 

Precautions for X-ray Diffraction (XRD) Technology

 

(1) Solid samples should have a surface area greater than 10 × 10 mm and a thickness above 5 μm. The surface shall be flat, and multiple pieces may be bonded together if necessary.

 

(2) For lamellar or cylindrical samples, significant preferred orientation may occur, leading to abnormal diffraction intensity. Therefore, the testing direction shall be specified.

 

(3) For measuring microstress (lattice distortion) in metallic samples and for residual austenite measurement, the sample shall be prepared as a metallographic specimen and subjected to standard polishing or electrolytic polishing to eliminate the surface strain layer.

 

(4) Powder samples shall be ground to a particle size of 320 mesh (approximately 40 μm in diameter), with a total weight greater than 5 g.

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