Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Focused Ion Beam

Focused Ion Beam (FIB) non-site-specific cutting is an advanced micro-nano processing technology. It utilizes a focused ion beam to cut materials without the need to predetermine an exact cutting point.

Focused Ion Beam

| Project Overview

 

Focused Ion Beam (FIB) non-site-specific cutting is an advanced micro-nano processing technology. It utilizes a focused ion beam to cut materials without the need to predetermine an exact cutting point. The FIB system generates a high-energy ion beam, and by adjusting the beam parameters, the depth and precision of the cut can be controlled. This technology has wide applications in fields such as semiconductors and materials science. It enables rapid cutting of samples to observe internal structures and can also be used to fabricate micro- and nano-structures of specific shapes. The flexibility of non-site-specific cutting allows it to adapt to different experimental needs, providing a powerful tool for research and development.

 

 

| Test Objective

 

1. To quickly analyze the internal structure of samples, there is no need to predefine specific cutting locations; cutting regions can be flexibly selected according to actual observation requirements.

 

2. In fields such as semiconductors, it helps researchers gain a better understanding of the microscopic properties and performance of materials, providing a basis for the development and improvement of new materials.

 

3. Assist in failure analysis by performing non-site-specific cutting on problematic samples to locate fault points and causes, thereby supporting corrective measures and repairs.

 

 

| Testing Standards

 

JY/T 0583-2020 General analytical rules for the focused ion beam system.

 

 

| Service Products / Fields

 

Integrated circuit chips, semiconductor devices, printed circuit boards, electronic connectors, optical lenses, nanomaterials, composite materials, and medical devices.

 

 

| Project Advantages

1. High precision and high resolution

2. Flexible processing capability

3. Minimal sample damage

4. Can be combined with other technologies

5. High processing efficiency.

 

 

| MTT Advantages

 

1. Professional Team: A team of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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