Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Surface Insulation Resistance

With the rapid development of the electronics industry, electronic products become increasingly miniaturized, thin, and light. This trend places higher requirements on the reliability and durability of electronic products. To ensure that electronic products can operate stably for a long time in various environments, reliability testing of products and their components has become particularly important.

Surface Insulation Resistance

With the rapid development of the electronics industry, electronic products become increasingly miniaturized, thin, and light. This trend places higher requirements on the reliability and durability of electronic products. To ensure that electronic products can operate stably for a long time in various environments, reliability testing of products and their components has become particularly important.

 

Traditional insulation performance tests are mostly one-time detections at normal temperature and under normal conditions, which cannot simulate the continuous impact of environmental factors on insulation performance during long-term use. Therefore, a test method that can simulate complex environments and evaluate the change of insulation performance over time is needed. The SIR (Surface Insulation Resistance) test emerged as the times require.

 

 

| Project Background

 

With the rapid development of the electronics industry, electronic products become increasingly miniaturized, thin, and light. This trend places higher requirements on the reliability and durability of electronic products. To ensure that electronic products can operate stably for a long time in various environments, reliability testing of products and their components has become particularly important.

 

Traditional insulation performance tests are mostly one-time detections at normal temperature and under normal conditions, which cannot simulate the continuous impact of environmental factors on insulation performance during long-term use. Therefore, a test method that can simulate complex environments and evaluate the change of insulation performance over time is needed. The SIR (Surface Insulation Resistance) test emerged as the times require.

 

 

| Project Overview

 

The SIR (Surface Insulation Resistance) test is a key detection method used in the electronics manufacturing industry to evaluate the surface insulation performance of printed circuit boards (PCBs), electronic components, or assemblies. Its core purpose is to detect the impact of surface contaminants (flux residues, metal ions, dust, etc.) or a humid environment on insulation performance, and to avoid problems such as short-circuits and leakage currents caused by insulation failure.

 

 

| Test Objective

 

1. Evaluate surface insulation performance: By measuring the resistance value between two points on the surface of the insulating material, determine whether it can effectively prevent current leakage and avoid short-circuits, leakage currents, or electrical performance degradation caused by surface contamination.

 

2. Verify process reliability: Detect whether there are residual contaminants (flux residues, finger oil stains, dust, etc.) in the process of welding, cleaning, assembly, etc., to ensure that the process control meets the standards.

 

3. Forecast product life: In an accelerated environment such as high humidity and heat, simulate the surface insulation degradation trend of the product during long-term use, and discover potential failure risks (such as short-circuits caused by electrochemical migration) in advance.

 

 

| Testing Standards

 

IPC-TM-650 2.6.3.3B, IPC-TM-650 2.6.3.7, GB/T 4677, etc.

 

 

| Service Products / Fields

 

Manufacturing and maintenance of electrical equipment:

Factory inspection and regular maintenance of the insulation performance of equipment such as motors, transformers, cables, and switches.

 

For example: Insulation testing between transformer windings and between windings and the enclosure to ensure that there is no leakage or short-circuit during equipment operation.

 

Electronic components and circuit boards:

Inspection of the insulation layers of components such as capacitors, resistors, and integrated circuits, as well as insulation testing between the circuits of PCB boards (printed circuit boards).

 

Research and development and quality control of insulating materials:

Performance evaluation of insulating materials such as plastics, rubbers, ceramics, and glass fibers, such as judging the insulation stability of materials in environments such as humidity and high temperature.

 

High-end fields such as aerospace and automotive electronics:

In scenarios with extremely high requirements for insulation reliability (such as aircraft cables and insulation layers of automotive power batteries), the insulation resistance needs to be strictly tested to ensure safety.

 

 

| Project Advantages

 

MTT has three sets of insulation resistance testing systems (IPC-650S-1K5, IPC-650S, TI-SIR-256-5-4), with a total of 256 + 256 + 256 = 768CH. It can automatically collect insulation resistance test data. Among them, the maximum test voltage of the IPC-650S-1K5 can reach 1KV, and the measurement range can reach 10⁶-10¹⁴ Ω.

 

 

| Testing Principle

 

Under the specified environmental conditions (temperature, humidity), apply a DC voltage to two electrodes (or conductors) on the surface of the test specimen, measure the leakage current between the electrodes, and calculate the surface insulation resistance (SIR = applied voltage / leakage current) according to Ohm's law.

 

 

| MTT Advantages

 

1. Professional Team: The project team has rich testing experience and professional knowledge, and can provide customers with comprehensive testing solutions and technical support.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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