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Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Solder Joint Reliability
Solder Joint Quality Assessment
Numerical Simulation Analysis
UL Certification Consultation
High Temperature and High Humidity Test
Corrosion Resistance Test
Particulate Cleanliness
Foreign Object Analysis
Tin Whiskers Observation
Ionic Cleanliness
Temperature Cycling Test
Slicing Analysis
Intermetallic Compound
PCB Stress-Strain Test
PCBA Solder Joint Quality Assessment
Dyeing Test
PCBA Welding Process Qualification
Solder Mask
PCB Physical Property Test
Visual Inspection
Mechanical strength of solder joints
Plated Through-Hole Test
Dynamic thermal deformation (curvature)
TMA Test
Thermogravimetric Analysis
Differential Scanning Calorimeter
Thermal Conductivity
Combustion Test
Principal Component Analysis of Insulation Substrate
Mechanical Property Testing
Thermal Stress Test
Dimensional Measure
ECM/CAF Test
PCB Hazardous Substance Detection
PCB Electrical Performance
Vibration Test
Copper Purity Of Conductor
Solderability Test
Control Of Incoming Electronic Materials
Reliability Assessment Of Electronic Accessories
Compatibility Assessment Of Electronic Accessories And Processes
Selection And Evaluation Of Electronic Accessories
Cleaning Agent Test
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Volatile Organic Compounds
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Macroscopic Metallographic Analysis
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Brand Identification/Recommendation
Electrical Properties (metal)
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Melting Point Test（Metal）
Hardness Test
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Total Component Analysis
Material Thermal Analysis
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Fiberglass Content
Ash Content
Flame Retardant Test
Specific Heat Capacity Test
Thermal Expansion Coefficient Test
Glass Transition Temperature
Melting Point Test (Polymer)
Fatigue Test
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Bending Compression Test
Tensile Test
Temperature and Humidity Cyclic
Surface Insulation Resistance
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The Three-Combination Test
Drop Test
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Thermal Shock Test
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pH Value
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Total Organic Carbon
Elemental Analysis
Ionic Analysis
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Nanoindentation/Nanohardness
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Automotive Electronic Reliability Testing
PCBA/PCB Testing and Analysis Services
Automotive Electronic Component Test
Connector End Plate Test
Mechanical Testing Of Connectors
Connector Environmental Testing
Electrical Performance Testing Of Connectors
Terminal Mechanical Performance Testing
Mechanical Reliability
Environmental Reliability
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Component Fatigue Life Test
AEC-Q器件可靠性评价
Corrosion Resistance Test
成分分析
Particulate Cleanliness Test
Gravel Impact Test
Abrasion Test
Nondestructive Test
Non-Metallic Materials
Metal Material
Coating/Plating Detection
Performance testing of automotive materials
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汽车禁用物质/ELV
Cells Contact System
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EMMI Localization
Glass Passivation Layer
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Strength Test
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C-SAM
SEM
AES
Excitation Test
Reproduction Test
CDM ESD
HBM ESD
X-RAY
Board-Level Failure Analysis
Whole-Machine Failure Analysis
Hardware White-Box Testing Projects
Component Failure Analysis
Sealing Device
Capacitive MLCC
Expired Material – IC
Counterfeit/Refurbished Device
Plastic-encapsulated Devices
人体模型（HBM）静电放电及闩锁（LU）
Latch-up
Chip Aging and Lifetime Test
Chip Reliability Hardware Design Services
Chip Packaging Reliability Environmental Tests
Automotive Chip Electronic Reliability Testing
Evaluation Of New Materials/New Processes
硬件白盒测试
Localization Device Certification
EHMS
Mixed Oil Analysis
Component Analysis
Debris Analysis
Oil Filter Analysis
Oil Quality Testing
Reliability test
腐蚀试验
Nondestructive Testing
显微分析
异物分析
Bending Test
Long-term Creep Test
Shear Test
硬度测试
Compression Test
Advanced Material Characterization
Destructive physical Analysis
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Laser Decapsulation

Laser opening is used for observing the internal structure of chips, analyzing the causes of chip failures, conducting other tests such as FIB, EMMI, chip cutting, and lead tension testing. MTT can provide professional testing services, quickly respond to customer needs, and provide one-stop efficient testing services.

Laser Decapsulation

| Project Overview

 

Decapsulation (decap/open-top) involves partial laser decapsulation of packaged chips followed by chemical etching, exposing the chip while maintaining its functionality intact, and ensuring that the die, bond pads, bond wires, and leads remain undamaged. After decapsulation, subsequent procedures such as internal inspection, failure analysis, FIB, and EMMI can be performed.

 

 

| Test Objective

 

Observation of the internal structure of the chip, root cause analysis of chip failures, and other tests such as FIB, EMMI, chip shear testing, and bond wire pull testing.

 

 

| Testing Standards

 

GJB 4027B-2021 ；GJB 548C-2021；GJB 128B-2021.

 

 

| Service Products / Fields

 

A wide variety of packaged chips and resistors made of different materials, such as BGA, QFP, QFN, SOT, DIP ceramics, COB, and metal packages, can be decapsulated. This technique is extensively applied in chip analysis, electronic component repair, and research and development.

 

 

| Project Advantages

 

1. Chemically decapsulated samples are clean, with the internal structure remaining intact.

 

2. Mechanically decapsulated samples are free from contamination by external elements.

 

3. Fast decapsulation speed and convenient operation.

 

4. The decapsulation range is controllable.

 

 

| Test Analysis Diagram

 

 

 

| MTT Advantages

 

1. Professional Team: Equipped with a number of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.

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Further reading
Transmission Electron Microscopy Fault Diagnosis Test Multi Functional Solder Joint Test Industrial CT Focused Ion Beam Cross-section Polisher
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