Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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High Temperature and High Humidity Test

The high temperature and high humidity test is a reliability testing method that simulates the usage and storage conditions of products in extreme hot and humid environments. By artificially creating high-temperature and high-humidity environmental conditions, the performance, stability, and durability of products are evaluated.

High Temperature and High Humidity Test

The high temperature and high humidity test is a reliability testing method that simulates the usage and storage conditions of products in extreme hot and humid environments. By artificially creating high-temperature and high-humidity environmental conditions, the performance, stability, and durability of products are evaluated.

 

The core purpose of this test is to check whether the product can maintain normal functions in a hot and humid environment and to detect potential quality hazards in advance, such as material aging, structural deformation, and decline in electrical performance. This provides a basis for product design improvement, quality control, and reliability enhancement.

 

| Project Background

 

The high temperature and high humidity test for PCB (Printed Circuit Board) and PCBA (Printed Circuit Board Assembly, which is the finished product after soldering components on the PCB) is a core testing item designed by the electronics industry to evaluate the reliability of products in hot and humid environments. Its background is closely related to the application scenarios, failure risks, and quality control requirements of electronic devices.

 

 

| Project Overview

 

The high temperature and high humidity test is a reliability testing method that simulates the usage and storage conditions of products in extreme hot and humid environments. By artificially creating high-temperature and high-humidity environmental conditions, the performance, stability, and durability of products are evaluated.

 

The core purpose of this test is to check whether the product can maintain normal functions in a hot and humid environment and to detect potential quality hazards in advance, such as material aging, structural deformation, and decline in electrical performance. This provides a basis for product design improvement, quality control, and reliability enhancement.

 

In terms of test standards, the commonly used international standards are IEC and ISO, while in China, there are relevant standards such as GB/T. These standards clearly stipulate the environmental parameters, duration, sample handling, etc. of the test to ensure the scientific nature and comparability of the test results.

 

The test conditions are usually set according to the actual usage scenarios of the product and relevant standards. The temperature generally ranges from 40°C to 85°C, and the relative humidity ranges from 60% to 95%. The test duration varies from a few hours to several thousand hours. For example, for electronic and electrical products, the test is often carried out under the conditions of 40°C and 90%-95% relative humidity, and the duration may be 1000 hours.

 

The high temperature and high humidity test is applicable to a variety of products, including electronic components, electrical equipment, automotive parts, plastic and rubber products, coatings, etc. Through this test, it is possible to evaluate whether the solder joints of electronic components will experience false soldering or oxidation due to heat and humidity; check whether plastic parts will undergo dimensional changes or strength reduction due to moisture absorption; and verify whether the coatings will show phenomena such as blistering, peeling, and discoloration.

 

After the test, the samples will be subjected to appearance inspection, performance testing, etc., and a comparative analysis will be made with the state before the test to determine whether the product meets the relevant reliability requirements. If the product's performance indicators exceed the allowable range or there is obvious damage to the appearance during the test, it indicates that its reliability in a hot and humid environment is insufficient, and targeted improvements are needed.

 

 

| Test Objective

 

1. Expose defects in advance: Before mass-producing or launching a product into the market, discover problems in design (such as unreasonable line spacing design), materials (such as poor moisture resistance of the solder mask), or processes (such as poor copper plating) through tests to avoid batch failures.

 

2. Verify design reliability: Confirm that the product can maintain key performance (such as insulation resistance ≥10⁸Ω, no short circuits/ open circuits) even after experiencing high-temperature and high-humidity environments within the expected service life (for example, consumer electronics usually require 3 to 5 years, and industrial equipment requires more than 10 years).

 

3. Support product certification: Many industries (such as the automotive and medical industries) require products to pass reliability tests such as high temperature and high humidity tests as the basis for market entry certification to ensure that products meet safety and performance standards.

 

In summary, the background of the high temperature and high humidity test for PCB/PCBA stems from the challenges of the actual application environment, the need for targeted verification of core failure mechanisms, and the promotion of industry quality control and standardization. It is a key testing link to ensure the reliable operation of electronic equipment in hot and humid environments. 

 

 

| Testing Standards

标准类型

Standard type

典型标准编号

Typical standard numbers

适用场景

Applicable scenarios

国际标准

international standard

IEC 60068-2-30

规定交变湿热试验(温度循环 + 湿度变化),适用于电子元件及组件。

Specifies the alternating damp-heat test (temperature cycling + humidity change), applicable to electronic components and assemblies.

电子行业标准

Electronic industry standard

IPC-9102

针对 PCBA 的可靠性测试,包含高温高湿条件(如 85℃/85% RH,1000 小时)。

For the reliability test of PCBA, including high-temperature and high-humidity conditions (such as 85°C/85% RH for 1000 hours).

元器件标准

Component standard

JEDEC JESD22-A101

半导体器件的恒定湿热试验(如 40℃/93% RH,1000 小时)。

Constant damp-heat test for semiconductor devices (such as 40°C/93% RH for 1000 hours).

国内标准

Domestic standard

GB/T 2423.3-2006

等同 IEC 60068-2-78,规定恒定湿热试验;GB/T 2423.4-2008 对应交变湿热试验。

It is equivalent to IEC 60068-2-78, which stipulates the constant damp-heat test; GB/T 2423.4-2008 corresponds to the alternating damp-heat test.

 

 

| Service Products / Fields

 

Electronics and electrical field

Products in this field are relatively sensitive to the damp-heat environment, and the high temperature and high humidity test is an indispensable link. It includes various electronic components, such as resistors, capacitors, inductors, chips, etc. Through the test, it can be checked whether their performance parameters will drift, short-circuit or even fail due to damp-heat; there are also consumer electronic products such as mobile phones, computers, televisions, and household appliances such as refrigerators, air conditioners, washing machines. The test can verify whether they can be normally turned on and operated in the damp-heat environment and whether their functions are stable, to avoid problems such as screen flickering and key failure.

 

Automobile industry field

During driving and parking, automobiles often face high-temperature and high-humidity environments in different regions, and relevant parts need to undergo strict tests. Automobile electronic components, such as in-vehicle navigation, sensors, ECU (electronic control unit), etc. The test can evaluate their working reliability in high-temperature and high-humidity areas such as the engine compartment; automobile interior parts, such as seat fabrics, dashboard plastic parts, etc. Through the test, it can be judged whether mildew, aging, deformation, etc. will occur; in addition, automobile lamps, wiring harnesses, etc. also need to undergo high temperature and high humidity tests to ensure that their performance is not affected by damp-heat.

 

Materials and chemical industry field

The performance changes of various materials in the damp-heat environment are the focus of attention in this field. For plastic and rubber products, such as pipes, seals, gaskets, etc., the test can detect whether phenomena such as dimensional expansion, hardness reduction, and fracture occur due to moisture absorption; for coating and coating products, the test can observe problems such as blistering, peeling, discoloration, and powdering, and evaluate their protective performance; for metal materials and their products, the test can examine the rusting situation in high-temperature and high-humidity environments and judge their corrosion resistance.

 

Medical device field

The reliability of medical devices is directly related to the life safety of patients, so high temperature and high humidity tests are crucial. For medical electronic equipment, such as monitors and defibrillators, the test can ensure the accuracy of measurement data and the stability of equipment operation in a humid and hot environment; for disposable medical devices, such as infusion sets and syringes, the test can examine whether the materials will degrade due to heat and humidity, which may affect the safety of use.

 

Aerospace field

The environment where aerospace products are located is complex and changeable, and high temperature and high humidity tests are important means to ensure their reliability. For electronic equipment, sensors, cables, etc. on aircraft, the test can simulate the conditions in the high-altitude humid and hot environment or during ground storage to verify whether they can work normally; for aerospace materials, such as the shell materials and thermal insulation materials of spacecraft, the test can evaluate whether their physical and chemical properties are stable in a humid and hot environment.

 

 

| Project Advantages

 

1. Discover potential problems in advance and reduce market risks.

2. Improve product reliability and enhance market competitiveness.

3. Provide a scientific basis for product design optimization.

4. Meet industry standards and regulatory requirements to expand market access.

5. Reduce production costs and improve production efficiency.

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