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Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Solder Joint Reliability
Solder Joint Quality Assessment
Numerical Simulation Analysis
UL Certification Consultation
High Temperature and High Humidity Test
Corrosion Resistance Test
Particulate Cleanliness
Foreign Object Analysis
Tin Whiskers Observation
Ionic Cleanliness
Temperature Cycling Test
Slicing Analysis
Intermetallic Compound
PCB Stress-Strain Test
PCBA Solder Joint Quality Assessment
Dyeing Test
PCBA Welding Process Qualification
Solder Mask
PCB Physical Property Test
Visual Inspection
Mechanical strength of solder joints
Plated Through-Hole Test
Dynamic thermal deformation (curvature)
TMA Test
Thermogravimetric Analysis
Differential Scanning Calorimeter
Thermal Conductivity
Combustion Test
Principal Component Analysis of Insulation Substrate
Mechanical Property Testing
Thermal Stress Test
Dimensional Measure
ECM/CAF Test
PCB Hazardous Substance Detection
PCB Electrical Performance
Vibration Test
Copper Purity Of Conductor
Solderability Test
Control Of Incoming Electronic Materials
Reliability Assessment Of Electronic Accessories
Compatibility Assessment Of Electronic Accessories And Processes
Selection And Evaluation Of Electronic Accessories
Cleaning Agent Test
Flux Test
Three-Proof Paint Test
Red Phosphorus Detection
Siloxane Test
ELV Test
Phthalate
Asbestos
Volatile Organic Compounds
Polycyclic Aromatic Hydrocarbons
Toxic Substances Control Act
PFAS
POPs Control
California 65
Registration, Evaluation, Authorization, and Restriction of Chemicals
RoHS Regulations
Halogen/Sulfur Content
Shear/Torsion Test
Microscopic Metallographic Analysis
Wear Test
High-Temperature Mechanics
Peel Strength Test
Surface Roughness
Non-metallic inclusions
Grain Size
Macroscopic Metallographic Analysis
Welding Residual Stress
Brand Identification/Recommendation
Electrical Properties (metal)
Depth Measurement Of Carburizing/Nitriding/Hardening Layer
Melting Point Test（Metal）
Hardness Test
Principal Component Analysis
Total Component Analysis
Material Thermal Analysis
Phase Analysis
Fiberglass Content
Ash Content
Flame Retardant Test
Specific Heat Capacity Test
Thermal Expansion Coefficient Test
Glass Transition Temperature
Melting Point Test (Polymer)
Fatigue Test
Impact/Toughness Test
Bending Compression Test
Tensile Test
Temperature and Humidity Cyclic
Surface Insulation Resistance
Rapid Temperature Change Test
The Three-Combination Test
Drop Test
Mechanical Shock Test
Dust Test
Salt Spray Corrosion Test
Flow Gas Corrosion Test
Thermal Shock Test
High Temperature / Low Temperature Storage
Total Bacterial Count
Total Dissolved Solids
pH Value
Conductivity
Total Organic Carbon
Elemental Analysis
Ionic Analysis
Purified Water Physicochemical Analysis
Microscopic Analysis
X-ray Diffraction
Optical Microscope
Time of Flight Secondary Ion Mass Spectrometry
Dynamic Secondary Ion Mass Spectrometry
X-ray Photoelectron Spectroscopy
EBSD
AFM
Nanoindentation/Nanohardness
Basic Performance Test of Automotive Thermal Management
Automotive Electronic Reliability Testing
PCBA/PCB Testing and Analysis Services
Automotive Electronic Component Test
Connector End Plate Test
Mechanical Testing Of Connectors
Connector Environmental Testing
Electrical Performance Testing Of Connectors
Terminal Mechanical Performance Testing
Mechanical Reliability
Environmental Reliability
Electrical Performance Reliability
Component Fatigue Life Test
Automotive Chip Electronic Reliability Testing
Corrosion Resistance Test
Component Analysis
Particulate Cleanliness Test
Gravel Impact Test
Abrasion Test
Nondestructive Test
Non-Metallic Materials
Metal Material
Coating/Plating Detection
Performance testing of automotive materials
Automotive Pipeline Performance Test
ELV Test
Cells Contact System
Transmission Electron Microscopy
Fault Diagnosis Test
Multi Functional Solder Joint Test
Industrial CT
Focused Ion Beam
Cross-section Polisher
Optical Beam Induced Resistance Change
Thermal EMMI
EMMI Localization
Glass Passivation Layer
Delayering Test
Cratering Test
Sample Preparation Microscopy
Internal Visual Inspection
Laser Decapsulation
Strength Test
External Visual Inspection
C-SAM
SEM
AES
Excitation Test
Reproduction Test
CDM ESD
Human Body Model Electrostatic Discharge
X-RAY
Board-Level Failure Analysis
Whole-Machine Failure Analysis
Hardware White-Box Testing Projects
Component Failure Analysis
Sealing Device
Capacitive MLCC
Expired Material – IC
Counterfeit/Refurbished Device
Plastic-encapsulated Devices
Human Body Model Electrostatic Discharge
Latch-up
Chip Aging and Lifetime Test
Chip Reliability Hardware Design Services
Chip Packaging Reliability Environmental Tests
Automotive Chip Electronic Reliability Testing
Evaluation Of New Materials/New Processes
Hardware White-Box Testing Projects
Localization Device Certification
EHMS
Mixed Oil Analysis
Component Analysis
Debris Analysis
Oil Filter Analysis
Oil Quality Testing
Reliability test
Corrosion Resistance Test
Nondestructive Testing
Scanning Electron Microscopy
Foreign Object Analysis
Bending Test
Long-term Creep Test
Shear Test
Hardness Test
Compression Test
Advanced Material Characterization
Destructive physical Analysis
Electrical performance test
Accuracy and response characteristic test
Reliability and durability test
Compatibility test
Safety test
Functional and performance test
Reliability and durability test
Compatibility test
Safety test
Function and energy efficiency test
Reliability and durability test
Compatibility test
Physicochemical property test
Heat transfer performance test
Material compatibility test
Environmental adaptability/aging test
Safety performance test
Sealing performance test
insertion and extraction life and mechanical performance
Mechanical environment reliability
Structural strength test
Compatibility test
Sealing and pressure resistance test
Flow distribution performance test
Structural reliability test
Interface adaptability and chemical tests
Safety tests
Thermal performance test
Reliability and durability testing
Compatibility test
Safety tests
Static performance test
Dynamic performance test
Reliability and durability test
Thermal performance test
Reliability test
Safety test
Energy efficiency test
Compatibility test
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Failure Analysis, Precise Targeting

Build an integrated solution for product lifecycle inspection, analysis, and prevention to empower enterprises to achieve excellent quality and reduce costs while increasing efficiency.
PCB/PCBA Failure Analysis

By conducting failure analysis of PCB and PCBA failure phenomena, and through a series of analytical validations, the root causes and mechanisms of failures can be identified. This is of great importance for bettering product quality, improving production processes, and arbitrating failure-related disputes.


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01 / 05
Electronic Component Failure Analysis

MTT possesses profound technical expertise in electronic component failure analysis, complete analytical methodologies, a vast database of failure analysis cases, and a team of seasoned experts, enabling us to provide high-quality and efficient failure analysis services.


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02 / 05
Integrated Circuit Failure Analysis

MTT Leveraging its deep expertise in integrated circuit failure analysis, a comprehensive lifecycle-wide analytical platform, a vast failure case database, and a team of senior experts, MTT delivers precise, efficient, and end-to-end solutions ranging from failure reproduction to root cause identification and corrective recommendations.


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03 / 05
Polymer Material Failure Analysis

The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.

Leveraging extensive expertise in polymer failure analysis, a comprehensive hardware platform, a large-scale case database, and a team of seasoned experts, MTT provides precise, efficient, end-to-end failure analysis solutions.


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04 / 05
Failure Analysis of Metal Materials and Components

Based on its extensive experience in metal material failure analysis, MTT possesses a comprehensive analytical platform and, leveraging a vast and complete failure case database together with a team of seasoned experts, provides holistic, precise, and efficient solutions ranging from diagnosing failure phenomena to in-depth root cause analysis and recommendations for preventive countermeasures.


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05 / 05

About MTT

A commercial third-party laboratory with national accreditation

We focus on providing customers with testing services, technical consulting services, and solution services. Our services cover industries including electronic manufacturing, automotive electronics, semiconductors, aerospace materials, and liquid cooling for AI computing servers.

Material Testing has established testing bases in Shenzhen, Suzhou, Xi’an, Beijing, and Shanghai, and set up multidisciplinary testing and analysis laboratories. Based on materials science engineering and electronic reliability engineering, the company has developed an "industrial hospital" service model. By utilizing scientific testing standards and methods, relying on professional engineers and technicians as well as precision instruments and equipment, we help customers resolve various quality-related issues encountered during product R&D, production, trade, and other stages.

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Authoritative Certification, Quality Selection

With multiple international authoritative certifications, we use our expertise to build a solid safety line for products. Our technical strength and service quality have been highly recognized by the market.
  • CNAS
  • CMA
  • Quality Management System Certification Certificate
  • Approval Letter for Civilian Fuel Testing Facility
  • Nadcap
  • CFM
  • Guangdong Provincial Public Service Demonstration Platform for Small and Medium-sized Enterprises
  • National High-Tech Enterprise Certificate
  • Failure Analysis Network Unit
  • Specialized, Refined, Unique, and Innovative Certificate - Shenzhen Meixin

Diversified Fields, Professional Services

With professional hard-core strength, we provide comprehensive services such as testing, technical consulting, and solutions to help customers in multiple fields upgrade their product quality.
Electronic Manufacturing Solutions
MTT focuses on the electronic manufacturing sector, continuously deepening expertise and enhancing service capabilities. An all-around and mature testing service system has been established, which can provide testing services throughout the entire life cycle. With a professional team and advanced equipment, we can precisely meet the needs of customers, helping enterprises improve product quality, upgrade technologies, and enhance market competitiveness.
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Automotive Electronics Solutions
MTT continuously delivers material physicochemical performance testing, reliability testing and lifetime evaluation, as well as failure analysis services for complete vehicle manufacturers and supply chain enterprises.
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Semiconductor Solutions
Focus on the full-semiconductor industry chain testing services, covering solutions from chip design to wafer foundry/production, packaging or testing, soldering and assembly (SMT), complete machine assembly/product verification, and end-use. Leveraging core technologies in failure analysis and reliability verification.
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Solution for Aviation Materials and Parts
MTT has been deeply involved in the material evaluation of aero-engine health management and the failure analysis of components for more than a decade. We have provided high-reliability technical support for global leading aviation enterprises, helping to achieve the "zero-hidden-danger" operation of key components.
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Integrated thermal management solutions for liquid cooling in the field of AI computing power servers
Energy consumption and heat dissipation needs in data center had increased dramatically. Besides, there had been an urgent need for green and energy-saving technologies under the "dual carbon" goal. Against this background, the integrated thermal management solutions for liquid cooling in the field of AI computing power servers were developed. With the development of AI, cloud computing, and related technologies, server power density continues to rise, making traditional air-cooling technology insufficient to meet high-efficiency cooling requirements. As a result, liquid cooling has become the key solution.
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We accurately convey the forefront pulse of the industry for you, share every bit of MTT, and explore new trends and opportunities in the industry with you.
Corporate News
Maxin Testing Supports Successful Conclusion of the 2025 National Failure Analysis Academic Conference! Exploring the Cutting Edge of Failure Analysis Technology Together
From August 10 to 12, 2025, the “2025 National Failure Analysis Academic Conference” and the “China College Students Mechanical Engineering Innovation and Creativity Competition—‘Oubotong Cup’ Failure Analysis Contest,” jointly organized by the Failure Analysis Branch of the Chinese Mechanical Engineering Society and Beihang University, were successfully held at the Shahu Campus of Beihang University.
2025.08.18
Corporate News
The IPC CIT Club gathering (Shenzhen - Huizhou) hosted by Meixin Testing concluded successfully, injecting new momentum into the electronics manufacturing industry.
On August 16, 2025, the CIT Club gathering (Shenzhen - Huizhou) co-hosted by Shenzhen Meixin Testing Technology Co., Ltd. (hereinafter referred to as “Meixin Testing”) and IPC was successfully held.
2025.08.18
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