
The integrity inspection of the Glass Passivation Layer is performed through microscopic observation, electrical performance testing, or specialized detection techniques to evaluate the continuity, compactness, and defect conditions of the glass passivation layer (typically SiO₂, Si₃N₄, or other glass-like thin films) on the surface of semiconductor devices.
| Project Overview
The integrity inspection of the Glass Passivation Layer is performed through microscopic observation, electrical performance testing, or specialized detection techniques to evaluate the continuity, compactness, and defect conditions of the glass passivation layer (typically SiO₂, Si₃N₄, or other glass-like thin films) on the surface of semiconductor devices. Serving as a protective layer on the chip surface, the glass passivation layer isolates external contaminants (such as moisture and ions) and suppresses surface leakage current, with its integrity directly influencing the reliability of the device.
| Test Objective
1. Defect Screening: Detect physical defects (such as cracks, pinholes, and delamination) and structural anomalies in the glass passivation layer to prevent device short circuits or corrosion caused by the failure of the protective layer.
2. Electrical Performance Verification: Confirm the insulating properties and breakdown resistance of the passivation layer to prevent surface leakage or device failure induced by electric field concentration.
3. Process Evaluation: Verify the uniformity and compactness of the passivation layer deposition process (such as PECVD or LPCVD) and optimize thin film growth parameters (such as temperature and gas ratio).
4. Reliability Prediction: Assess the stability of the passivation layer under environmental stresses (such as high temperature, humidity, and radiation) to predict the risk of device failure during long-term operation.
5. Failure Analysis: When surface leakage or corrosion failures occur in the device, identify the root cause (such as film deposition defects or stress-induced cracking) through passivation layer integrity inspection.
| Testing Standards
GJB 4027B-2021、MIL-STD-883H、GJB 548C-2021。
| Service Products / Fields
Power semiconductor devices, integrated circuits and chips, sensors and optoelectronic devices, military and aerospace electronics, automotive electronics, and the energy sector.
| MTT Advantages
1. Professional Team: A team of highly experienced testing engineers and technical experts.
2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.
3. Precise Defect Localization: Capable of detecting defects across the full scale, from micron-level cracks to nanometer-level pinholes, thereby enhancing inspection resolution.
4. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.
5. Authoritative Certification: The laboratory is accredited with ISO/IEC 17025, ensuring that test reports carry international credibility.