Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Professional verification platform, delivering precise data insights to build a solid foundation of trust for investors.
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Glass Passivation Layer

The integrity inspection of the Glass Passivation Layer is performed through microscopic observation, electrical performance testing, or specialized detection techniques to evaluate the continuity, compactness, and defect conditions of the glass passivation layer (typically SiO₂, Si₃N₄, or other glass-like thin films) on the surface of semiconductor devices.

Glass Passivation Layer

| Project Overview

 

The integrity inspection of the Glass Passivation Layer is performed through microscopic observation, electrical performance testing, or specialized detection techniques to evaluate the continuity, compactness, and defect conditions of the glass passivation layer (typically SiO₂, Si₃N₄, or other glass-like thin films) on the surface of semiconductor devices. Serving as a protective layer on the chip surface, the glass passivation layer isolates external contaminants (such as moisture and ions) and suppresses surface leakage current, with its integrity directly influencing the reliability of the device.

 

 

| Test Objective

 

1. Defect Screening: Detect physical defects (such as cracks, pinholes, and delamination) and structural anomalies in the glass passivation layer to prevent device short circuits or corrosion caused by the failure of the protective layer.

 

2. Electrical Performance Verification: Confirm the insulating properties and breakdown resistance of the passivation layer to prevent surface leakage or device failure induced by electric field concentration.

 

3. Process Evaluation: Verify the uniformity and compactness of the passivation layer deposition process (such as PECVD or LPCVD) and optimize thin film growth parameters (such as temperature and gas ratio).

 

4. Reliability Prediction: Assess the stability of the passivation layer under environmental stresses (such as high temperature, humidity, and radiation) to predict the risk of device failure during long-term operation.

 

5. Failure Analysis: When surface leakage or corrosion failures occur in the device, identify the root cause (such as film deposition defects or stress-induced cracking) through passivation layer integrity inspection.

 

 

| Testing Standards

 

GJB 4027B-2021、MIL-STD-883H、GJB 548C-2021。

 

 

| Service Products / Fields

 

Power semiconductor devices, integrated circuits and chips, sensors and optoelectronic devices, military and aerospace electronics, automotive electronics, and the energy sector.

 

 

| MTT Advantages

 

1. Professional Team: A team of highly experienced testing engineers and technical experts.

 

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

 

3. Precise Defect Localization: Capable of detecting defects across the full scale, from micron-level cracks to nanometer-level pinholes, thereby enhancing inspection resolution.

 

4. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

 

5. Authoritative Certification: The laboratory is accredited with ISO/IEC 17025, ensuring that test reports carry international credibility.

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