| Project Background

Through testing, problems such as the wettability and oxidation degree of components or PCB bonding pads can be discovered in advance, avoiding defects such as false soldering, cold soldering, and solder joint cracking, and ensuring the consistency of soldering during mass production. The test results can guide the adjustment of parameters such as soldering temperature, time, and solder paste usage, and optimize the production process. International standards (IPC-J-STD-002/003, IEC 60068-2) and customers usually require a solderability test report to ensure that the products meet reliability certifications (such as in high-requirement fields like automotive electronics and aerospace). It helps the incoming quality control (IQC) to screen the components or PCBs provided by suppliers, preventing batch-quality accidents caused by material problems.

| Project Overview

After applying the specified flux to the components or PCBs, immerse them in the molten solder, and determine their solderability based on the solder wetting ratio or wetting force value.

| Test Objective

For components, evaluating solderability is to verify that the solderability of component leads and terminals meets the requirements specified in this standard, and also to confirm that storage has no adverse effect on soldering the components to the interconnection substrate. The solderability can be determined during component manufacturing, when the user receives the components, or before assembly and soldering.

For PCBs, it is to verify that the PCB manufacturing process and subsequent storage have no adverse effect on the solderability of the parts on the PCB that need to be soldered. A reference attached board or a representative part of the PCB can be used. Process the PCB according to the selected test method, and then separate a part of it from the PCB as a test specimen to evaluate the solderability.

| Testing Standards

IPC-J-STD-002 Solderability testing of component leads, terminals, lugs, pins, and wires;

IPC-J-STD-003 Solderability testing of printed circuit boards (PCBs);

IEC 60068-2 -20 Solderability testing;

GB/T 4677 Test methods of printed boards;

MIL-STD-202G Method 208H Solderability test;

MIL-STD-883G 2003.7 Solderability test.

| Service Products / Fields

Related products: PCB FPC

Related fields: Consumer electronics, automotive electronics, aerospace electronic products

| MTT Advantages

1. Professional Team: A team of highly experienced testing engineers and technical experts.

2. Advanced Equipment: Equipped with internationally leading testing instruments to ensure accuracy and reliability of results.

3. Efficient Service: Rapidly respond to customer needs and provide one-stop, high-efficiency inspection services.

4. Authoritative Certification: The laboratory is certified by ISO/IEC 17025, ensuring that test reports have international credibility.