Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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Maxin Testing is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Professional verification platform, delivering precise data insights to build a solid foundation of trust for investors.
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Counterfeit/Refurbished Device

The counterfeit refurbishment testing of components is the "firewall" of quality control, which is important for avoiding failure risks, maintaining market fairness, and safeguarding user rights through technological means, promoting industrial upgrading, and providing key support for the sustainable development of high-end manufacturing.

Counterfeit/Refurbished Device

| Risks and Hazards Posed by Counterfeit and Refurbished Devices

· High risk of failure, with significant randomness in failure occurrence.

 

 

| Refurbished Materials Are Largely Sourced from Used Recycled Devices

 

· Degradation during usage, with multiple stresses acting together, typically in the late stage of the bathtub curve;

 

· Damage introduced during the refurbishment process.

 

 

| Counterfeit Materials Are Often Inferior Substitutes or Domestic Parts Posed as Imported Ones to Gain Profit Margins.

 

Characteristics of Such Materials:

· Identical appearance;

· Functionally consistent.

 

序号

No.

试验项目

Test items

检查内容

Inspection Items

1

外观检查

Appearance inspection

商标、型号、批号、划痕、裂纹、引脚氧化腐蚀变色等等

Trademarks, models, batch codes, scratches, cracks, pin oxidation, corrosion discoloration, and others.

 

 

 

 

序号

No.

试验项目

Test items

检查内容

Inspection Items

2

X射线检查

X-ray inspection

内部结构(焊线方式、引线框架、芯片等)

Internal structure (bonding method, lead frame, chip, etc.)

 

 

 

 

序号

No.

试验项目

Test items

检查内容

Inspection Items

3

丙酮测试

Acetone test

表面标志能否被擦拭

Whether surface markings can be wiped off

4

开封检查

Decapsulation inspection

生产商标志、版本数据代码、焊线质量等

Manufacturer logos, version data codes, wire bonding quality, and so on.

5

晶元工艺分析

Wafer Process Analysis

分析晶元内部工艺、掺杂工艺等

Analysis of internal wafer processes, doping processes, and related factors

 

 

 

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