In the wave of technological innovation, reliability analysis of materials has increasingly become a key factor in ensuring product quality and enhancing industry competitiveness.

To delve into core topics such as the reliability and failure analysis of domestic components, the “Journey Westward: Unraveling the Mystery of Failure” Failure Analysis Technology Seminar was grandly convened in the ancient capital of Xi'an on May 23, 2024. Hosted by Shenzhen Meixin Testing Technology Co., Ltd. (hereinafter referred to as Meixin Testing) and co-organized by the Physical and Chemical Testing Professional Committee of the Shaanxi Provincial Society of Mechanical Engineering, the event provided a platform for in-depth exploration of these critical issues.

This conference brought together four industry leaders and attracted nearly 140 participants, including experts, scholars, and industry elites from across the country. Attendees shared insights on mainstream hot topics and jointly explored the latest research findings and cutting-edge technologies in materials failure analysis.

During the sharing session, Cui Fengzhou, General Manager of the Semiconductor Division at Meixin Testing, first introduced the fundamental concepts and characteristics of integrated circuits. He then focused on analyzing typical failure modes that domestically produced integrated circuits may encounter in practical applications. Cui elaborated on the causes of these failure modes and provided corresponding preventive measures and solutions, enabling attendees to gain a deeper understanding of how to ensure the reliability of integrated circuits.

Subsequently, Mr. Yang provided us with a detailed explanation of the fundamental elements of mechanical product failure analysis, including key information such as failure causes and mechanisms. Drawing upon his extensive experience in materials testing and analysis as well as aerospace product failure analysis, he offered numerous practical suggestions and solutions, providing valuable reference for in-depth research into mechanical product failure analysis.

Wang Lijuan, Project Lead for Polymer Failure Analysis at Meixin Testing, provided a detailed exploration of the failure mechanisms in polymer materials, covering various failure modes such as adhesive detachment, plastic cracking, coating blistering, and rubber cracking. She not only delved into the underlying chemical reactions and corrosion mechanisms behind these failure phenomena but also shared effective analytical approaches and solutions tailored to address these specific failure modes.

Finally, Mr. Xue elaborated on PCBA failure analysis methods and their applications, covering key elements in developing failure analysis plans, fundamental skill requirements, process monitoring, and case studies. He emphasized that well-designed failure analysis plans, professional skill requirements, and rigorous process monitoring are crucial for ensuring PCBA product quality and improving production efficiency. He demonstrated how scientific methodologies and precise techniques can identify the root causes of PCBA failures and proposed corresponding improvement measures.

During the interactive session, attendees engaged in free-flowing exchanges and lively discussions with the experts. The atmosphere was highly dynamic, with the experts providing detailed answers to questions and offering professional guidance and advice to participants.

This concludes our event successfully. The conference examined the key highlights and challenges currently encountered in materials failure analysis, driving progress and innovation in failure analysis technology. Experts shared practical experience and cutting-edge techniques in the field of failure analysis, offering attendees fresh perspectives and insights. This not only enhanced professional skills but also sparked further innovative thinking.