Cui Fengzhou, General Manager of the Semiconductor Division at Maxine Testing

Mr. Cui Fengzhou, General Manager of the Semiconductor Division at Maxine Testing, delivered two keynote presentations at the main and breakout sessions of the conference: “Failure Analysis Based on the Industrial Hospital Model” and “Enhancing Reliability Through Electronic Component Failure Analysis.”

Drawing on years of industry expertise, Mr. Cui provided an in-depth analysis of common causes of electronic component failures and effective strategies for enhancing reliability, offering valuable practical guidance to attendees.

Maxim Testing introduced the Industrial Hospital service model for failure analysis at an academic conference for the first time, receiving unanimous acclaim from participants.

Feng Xueliang, Expert in Electronic Process Failure Analysis at Meixin Testing

Meanwhile, Mr. Feng Xueliang, an expert in electronic process failure analysis at Meixin Testing, delivered a keynote presentation titled “From Soldering Defects to System Failures: Typical Failure Mechanisms and Case Studies in PCBA.” Through practical case studies, he elaborated in detail how soldering defects can trigger system-level failures, offering profound insights for industry peers.

Wang Dong, Deputy Head of the Process Technology Expert Group at AVIC Computing Institute

Mr. Wang Dong, Deputy Head of the Process Technology Expert Group at AVIC Computing Institute, presented “Root Cause Analysis of Failure in Avionics Assembly Processes and Strategies for Reliability Enhancement,” offering a systematic solution for improving reliability in the avionics field.

Researcher Wu Yeqing of Redi Aviation Technology (Beijing) Co., Ltd.

Researcher Wu Yeqing of Redi Aviation Technology (Beijing) Co., Ltd. focuses on “Electronic Component Selection and Replacement Analysis Technology,” providing the industry with precise guidance for component selection and replacement.

Chen Rui, Chief Process Engineer at Beijing Aerospace Microelectronics Technology Co., Ltd.

Mr. Chen Rui, Chief Process Engineer at Beijing Aerospace Microelectronics Technology Co., Ltd., presented “Analysis of Electronic Component Failure Cases.” Through real-world examples, he revealed failure mechanisms, providing crucial reference material for the industry.