Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Harbin Institute of Technology Faculty and Students Visit Meixin Testing | Deepening Exchange to Advance Industry-Academia-Research Integration
Release date:2025-07-07 00:00
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On August 16, 2025, the CIT Club (Shenzhen - Huizhou) gathering, jointly hosted by Shenzhen Meixin Testing Technology Co., Ltd. (hereinafter referred to as “Meixin Testing”) and IPC, was successfully held. This event brought together numerous professionals from the electronics manufacturing sector for in-depth discussions centered on three core components: standard interpretation, case analysis, and laboratory visits.


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At the outset of the event, Wang Jiazi, Assistant General Manager of Meixin Testing, delivered an opening address welcoming all attendees. She provided a detailed account of the company's development journey, technical capabilities, and core strengths in the testing field, highlighting Meixin Testing's role as an industry benchmark in technical support.


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IPC MIT instructor Mr. Kang provides a professional interpretation of the revised editions of the two core standards, IPC-A-610 and J-STD-001. Through comparative analysis of technical specifications between the new and old versions, he offers actionable guidance for enterprises implementing standard upgrades.


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IPC MIT instructor Li Donglan systematically elaborates on key technologies in flexible printed circuit (FPC) manufacturing processes, providing in-depth analysis of process challenges and solutions through typical engineering case studies.


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Feng Xueliang, an expert in electronic process failure analysis, presented a systematic solution from both theoretical principles and engineering practice perspectives, focusing on typical failure mechanisms and engineering case studies of PCBs and PCBA, with reference to high-frequency failure cases.


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In the afternoon, guided by Meixin Testing's professional engineers, attendees toured the company's reliability laboratory in Shenzhen. Through live demonstrations and explanations, the visit showcased the company's advanced equipment and technical capabilities.


Participants gained firsthand experience with cutting-edge testing equipment and methodologies, providing them with a more intuitive and in-depth understanding of quality control for electronic products.


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During the wrap-up session, the election for the new Deputy Director of the IPC CIT Club (Shenzhen-Huizhou) region was held first.


Notably, Feng Xueliang, an electronics process expert from Meixin Testing, was successfully elected as the Deputy Director of the IPC CIT Club (Shenzhen-Huizhou) region, injecting new vitality into the club's development.


Subsequently, representatives from various enterprises engaged in discussions on topics such as “The Value of IPC Standard Training for Corporate Development” and “Challenges and Innovations in Product Quality Enhancement.” They also proposed suggestions regarding the format and content of future offline activities, fostering a lively atmosphere throughout the session. As the event drew to a close, all attendees gathered for a group photo, marking a successful conclusion to the gathering.


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This event successfully established a platform for technical exchange and resource sharing among electronics manufacturing enterprises. Through the integration of standard technology conversion, case validation, and testing practices, it effectively enhances companies' process capabilities and quality management competencies.


As a technical service provider, Meixin Testing continuously deepens its expertise. We actively participate in the development and revision of standards annually, having contributed to over 60 standards to date.


We are honored to engage in discussions with IPC standard training instructors and extend our warm congratulations to Meixin Testing for being recognized once again as an “Outstanding Host of IPC Asia CIT Club Activities.”


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