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Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Solder Joint Reliability
Solder Joint Quality Assessment
Numerical Simulation Analysis
UL Certification Consultation
High Temperature and High Humidity Test
Corrosion Resistance Test
Particulate Cleanliness
Foreign Object Analysis
Tin Whiskers Observation
Ionic Cleanliness
Temperature Cycling Test
Slicing Analysis
Intermetallic Compound
PCB Stress-Strain Test
PCBA Solder Joint Quality Assessment
Dyeing Test
PCBA Welding Process Qualification
Solder Mask
PCB Physical Property Test
Visual Inspection
Mechanical strength of solder joints
Plated Through-Hole Test
Dynamic thermal deformation (curvature)
TMA Test
Thermogravimetric Analysis
Differential Scanning Calorimeter
Thermal Conductivity
Combustion Test
Principal Component Analysis of Insulation Substrate
Mechanical Property Testing
Thermal Stress Test
Dimensional Measure
ECM/CAF Test
PCB Hazardous Substance Detection
PCB Electrical Performance
Vibration Test
Copper Purity Of Conductor
Solderability Test
Control Of Incoming Electronic Materials
Reliability Assessment Of Electronic Accessories
Compatibility Assessment Of Electronic Accessories And Processes
Selection And Evaluation Of Electronic Accessories
Cleaning Agent Test
Flux Test
Three-Proof Paint Test
Volatile Organic Compounds
Red Phosphorus Detection
Siloxane Test
ELV Test
Phthalate
Asbestos
Polycyclic Aromatic Hydrocarbons
Toxic Substances Control Act
PFAS
POPs Control
California 65
Registration, Evaluation, Authorization, and Restriction of Chemicals
RoHS Regulations
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Shear/Torsion Test
Microscopic Metallographic Analysis
Wear Test
High-Temperature Mechanics
Peel Strength Test
Surface Roughness
Non-metallic inclusions
Grain Size
Macroscopic Metallographic Analysis
Welding Residual Stress
Brand Identification/Recommendation
Electrical Properties (metal)
Depth Measurement Of Carburizing/Nitriding/Hardening Layer
Melting Point Test（Metal）
Hardness Test
Principal Component Analysis
Total Component Analysis
Material Thermal Analysis
Phase Analysis
Fiberglass Content
Ash Content
Flame Retardant Test
Specific Heat Capacity Test
Thermal Expansion Coefficient Test
Glass Transition Temperature
Melting Point Test (Polymer)
Fatigue Test
Impact/Toughness Test
Bending Compression Test
Tensile Test
Temperature and Humidity Cyclic
Surface Insulation Resistance
Rapid Temperature Change Test
The Three-Combination Test
Drop Test
Mechanical Shock Test
Dust Test
Salt Spray Corrosion Test
Flow Gas Corrosion Test
Thermal Shock Test
High Temperature / Low Temperature Storage
Purified Water Physicochemical Analysis
Total Bacterial Count
Total Dissolved Solids
pH Value
Conductivity
Total Organic Carbon
Elemental Analysis
Ionic Analysis
Microscopic Analysis
X-ray Diffraction
Optical Microscope
Time of Flight Secondary Ion Mass Spectrometry
Dynamic Secondary Ion Mass Spectrometry
X-ray Photoelectron Spectroscopy
EBSD
AFM
Nanoindentation/Nanohardness
Basic Performance Test of Automotive Thermal Management
Automotive Electronic Reliability Testing
PCBA/PCB Testing and Analysis Services
Automotive Electronic Component Test
Connector End Plate Test
Mechanical Testing Of Connectors
Connector Environmental Testing
Electrical Performance Testing Of Connectors
Terminal Mechanical Performance Testing
Mechanical Reliability
Environmental Reliability
Electrical Performance Reliability
Component Fatigue Life Test
Automotive Chip Electronic Reliability Testing
Corrosion Resistance Test
Component Analysis
Particulate Cleanliness Test
Gravel Impact Test
Abrasion Test
Nondestructive Test
Non-Metallic Materials
Metal Material
Coating/Plating Detection
Performance testing of automotive materials
Automotive Pipeline Performance Test
ELV Test
Cells Contact System
Transmission Electron Microscopy
Fault Diagnosis Test
Multi Functional Solder Joint Test
Industrial CT
Focused Ion Beam
Cross-section Polisher
Optical Beam Induced Resistance Change
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EMMI Localization
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Delayering Test
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Sample Preparation Microscopy
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Laser Decapsulation
Strength Test
External Visual Inspection
C-SAM
SEM
AES
Excitation Test
Reproduction Test
CDM ESD
Human Body Model Electrostatic Discharge
X-RAY
Board-Level Failure Analysis
Whole-Machine Failure Analysis
Hardware White-Box Testing Projects
Component Failure Analysis
Sealing Device
Capacitive MLCC
Expired Material – IC
Counterfeit/Refurbished Device
Plastic-encapsulated Devices
Human Body Model Electrostatic Discharge
Latch-up
Chip Aging and Lifetime Test
Chip Reliability Hardware Design Services
Chip Packaging Reliability Environmental Tests
Automotive Chip Electronic Reliability Testing
Evaluation Of New Materials/New Processes
Hardware White-Box Testing Projects
Localization Device Certification
EHMS
Mixed Oil Analysis
Component Analysis
Debris Analysis
Oil Filter Analysis
Oil Quality Testing
Reliability test
Corrosion Resistance Test
Nondestructive Testing
Scanning Electron Microscopy
Foreign Object Analysis
Bending Test
Long-term Creep Test
Shear Test
Hardness Test
Compression Test
Advanced Material Characterization
Destructive physical Analysis
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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Stay updated with the latest news from Maxin Testing, including technical developments, exhibitions, and events. We build on a foundation of professional testing to deliver customized solutions for our clients, ensuring quality control from the source. This empowers our clients to stand out in the marketplace and achieve commercial success.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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The 2025 South China Region Failure Analysis Competition Concludes Successfully! Winners Announced: A Shining Arena of Innovation and Creativity
Release date：2025-07-21 00:00
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The 2025 China College Students Mechanical Engineering Innovation and Creativity Competition - Failure Analysis Division South China Regional Competition successfully concluded at Shenzhen University on July 9.


Co-hosted by Shenzhen University, the Casting and Die-Casting Branch of the Guangdong Society of Mechanical Engineering, and Shenzhen Meixin Testing Technology Co., Ltd., the event attracted outstanding teams from universities across Guangdong, Guangxi, Hainan, Fujian, and other provinces.


Centered on the theme “Failure Analysis Enhances Product Safety, Quality, and Reliability,” the event featured both Innovation and Creativity tracks for undergraduate and graduate students, showcasing the outstanding capabilities and innovative spirit of South China's students in the field of failure analysis.


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High-level competition, balancing innovation and creativity


Participating teams conducted in-depth research on failure cases across mechanical, materials, electronics, and chemical engineering fields, submitting entries that combined academic rigor with practical value. Innovation track teams presented independently researched, unpublished cases, while creativity track teams proposed novel solutions through reinterpretation of publicly available cases.


The regional competition was conducted online, where teams fully presented their research findings through 10-minute PowerPoint presentations followed by 5-minute Q&A sessions. Judges conducted comprehensive evaluations based on multiple dimensions including “problem description,” “analytical process,” “solution approach,” and “innovativeness.”


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Award Winners Announced, Outstanding Teams Emerge


Following rigorous evaluation, the competition has selected first, second, and third prize winners, along with merit awards, with a total award rate reaching 60%. Selected outstanding teams will advance to the national finals to compete alongside contestants from other regions.



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The South China Regional Finals have advanced 30% of the top teams to the National Finals, where they will compete for the championship at Beihang University's Shahu Campus from August 9 to 12. We look forward to these teams achieving even greater success on the national stage!


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The successful hosting of this competition would not have been possible without the strong support from universities, expert judges, and partners. As one of the organizing entities, Shenzhen Meixin Testing Technology Co., Ltd. remains committed to advancing failure analysis technology and cultivating talent. We will continue to contribute to innovation within the industry in the years ahead.


Congratulations once again to all the winning teams! See you in Beijing for the National Finals!

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Next item：Pooling Jiangcheng's Wisdom, Building a Reliable Foundation for Automotive Electronics | 2025 Maxim Automotive Electronics Reliability Technology Exchange Event Concludes Successfully in Wuhan
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