Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Second Call for Papers: 2025 National Conference on Failure Analysis
Release date:2025-06-04 00:00
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01 Conference Overview


Conference Introduction


Failure analysis has garnered increasing attention across various sectors in recent years. Not only does it guide mechanical product design, material selection, processing inspection, and quality management, but failure analysis technology also serves as a crucial basis for establishing technical specifications, scientific development plans, and legal arbitration. With China's rapid economic development and growth in the equipment manufacturing industry, failure analysis technology is finding increasingly widespread application.


The 2025 National Failure Analysis Academic Conference will convene in Beijing in August 2025. Jointly organized by the Failure Analysis Branch and the Physical and Chemical Testing Branch of the Chinese Mechanical Engineering Society, this conference represents another gathering for China's failure analysis industry, offering high-level, information-rich academic exchange. Distinguished academicians, scholars, and experts in failure analysis will deliver keynote presentations, summarizing research achievements in failure analysis and prevention, sharing experiences and techniques, and discussing strategic development for the discipline.


We cordially invite experts, scientists, university faculty and students, as well as professionals from the industry engaged in failure analysis and physical and chemical testing to participate. During the conference, a Failure Analysis and Physical/Chemical Testing Sample Exhibition will be organized, alongside expert consultation activities, providing a broader platform for exchange among enterprises, manufacturers, and engineering technicians.


Conference Dates


August 9–12, 2025. Registration: August 9, 2025. Conference: August 10–12, 2025.


Venue


Shahé Campus, Beihang University.


Organizers


Failure Analysis Branch, China Society for Mechanical Engineering

Physical and Chemical Testing Branch, China Society for Mechanical Engineering


Host Institution


Beihang University


02 Call for Papers


This conference invites submissions nationwide. Conference proceedings will be indexed on CNKI, with selected papers published in book form (with official ISBN). Due to limited publication capacity, submissions will be prioritized by submission date and quality until capacity is reached. We encourage active participation! Scope and requirements are as follows:


1) Principles and methods of failure analysis;

2) Physical and chemical testing techniques in failure analysis;

3) Analysis of typical failure cases;

4) Failure analysis and safety, risk assessment and management;

5) Analysis related to failure and design, materials and processes, and service environments;

6) Failure analysis prevention and prediction technologies;

7) Failure analysis and prevention for special materials and equipment;

8) Other relevant failure analysis and prevention technologies.

Research findings, academic and technical papers, analytical experiences, and recommendations related to failure analysis and physicochemical testing that have not been formally published elsewhere are welcome for submission.


Conference papers may be submitted via email. The subject line must clearly state “Submission for the 2025 National Failure Analysis Academic Conference,” and the Conference Secretariat must be notified simultaneously. After expert review, accepted submissions will receive notification of acceptance and page charges. For publication in book format, the page charge is 600 RMB per paper, limited to 4 pages per paper. Each additional page incurs an extra charge of 150 RMB. For publication in a conference proceedings collection indexed by CNKI, the page charge is 400 RMB per paper, limited to 4 pages per paper. Each additional page incurs an extra charge of 150 RMB. Papers for which page charges remain unpaid will not be included in the conference proceedings. Submitted papers must adhere to the formatting requirements specified in Attachment 1: “Paper Submission Template.”


Full paper submission deadline: June 15, 2025.


03 Payment Methods


Conference Registration Fees


1) Register by June 30: ¥1,600;

2) Register after June 30: ¥1,800;

3) Failure analysts, failure analysis experts, and students from the Failure Analysis Branch of the Chinese Mechanical Engineering Society: ¥1,600.




The Chinese Mechanical Engineering Society will collect registration and publication fees for this conference and issue invoices for conference fees and publication charges.




Official Conference Website:


https://meeting.cmes.orgmid=371&sid=1485;

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Conference Registration Payment QR Code

Please stay tuned for updates on the website and log in to register and make payments.

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Registration Channels:


"Shenzhen Meixin Testing Technology Co., Ltd.

Website or Official Account"


Sponsorship and Commercial Partnerships


To meet the promotional and networking needs of industry enterprises, the conference offers diverse advertising channels including conference proceedings advertisements, technical lectures, and corporate image displays. Companies interested in collaboration are welcome to contact Meixin Testing.


Contact Information


Paper Submission:


E-mail: shixiaofenxi@cmes.org


Contact:


Zhang Meixin  18126500389 (also WeChat ID)



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