Thermal performance test

TestBackground

With the explosive growth of AI computing power, the power consumption of a single server node has exceeded 5 kW, and the heat flux density of the chip has reached over 150 W/cm². Traditional air-cooling technology can no longer meet the high-density heat dissipation requirements. The thermal performance of the liquid cooling system directly determines the chip junction temperature control ability and the system heat dissipation limit, and it is the core indicator which ensures the stable output of computing power.

Test Introduction

The thermal performance test aims to comprehensively evaluate the heat dissipation ability of the liquid cooling system in a high-power-density operating environment. By simulating the chip heating load under real working conditions, measure the chip junction temperature, temperature uniformity, system thermal resistance, and heat dissipation capacity redundancy to verify whether the system can stably control the chip temperature within the design threshold.

Testing Objectives

Verify the heat dissipation ability of the system under rated and peak power consumption

Evaluate the chip junction temperature and temperature distribution uniformity

Determine the system thermal resistance and heat dissipation redundancy margin

Provide data support for the optimization of the system thermal design

Test Standards

T/CESA 1249.1-2023 Technical specification for the liquid cooled components in server and storage equipment - Part 1: Cold plate

YD/T 3980-2021 Technical requirements and test methods for cold-plate liquid-cooled server systems in data centers

OCP Liquid Cooling System Thermal Performance Test Guide

Applicable Products/Related Fields

Suitable for scenarios requiring high-power density heat dissipation, such as AI servers, high-performance computing clusters, liquid cooling systems in data centers, and GPU/CPU computing power platforms.

Test Content

Chip junction temperature test: Measure the chip surface temperature under the rated power consumption

Temperature uniformity test: Detect the temperature difference between chips using multi-point temperature sensors

System thermal resistance test: Calculate the heat transfer thermal resistance between the heat source and the coolant

Heat dissipation capacity redundancy test: Gradually increase the load to the system limit and record the critical point

Project Advantages

Adopts high-precision heat source simulators and multi-point temperature measurement systems, ensuring authentic and reliable data

Capable of simulating dynamic load changes, covering multiple working conditions including start-stop, peak load and steady-state operation

The test results can be directly used for PUE evaluation and system optimization design

Laboratory Configuration

High-precision heat source simulator (maximum power 5kW, accuracy ±1%)

Multi-point temperature acquisition system (thermocouple array, accuracy ±0.1°C)

Infrared thermal imager (FLIR A series)

Constant temperature cooling liquid circulation device

FAQ
Q: What is the difference between thermal performance testing and flow resistance testing? A: Thermal performance testing focuses on temperature and thermal resistance, while flow resistance testing focuses on pressure loss and flow characteristics. The two together determine the system's heat dissipation efficiency and energy consumption performance.