Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Reliability test

The reliability test simulates the performance stability of the system under extreme environments and long-term use through thermal cycling, vibration and shock, accelerated aging, and long-term operation tests, and verifies the structural integrity, sealing reliability, and functional durability.

Reliability test

Test Background


The liquid cooling system needs to operate continuously for a long time. The training cycle of large AI models can last from several weeks to several months. The system may experience performance degradation, leakage, or failure under the stress of thermal cycling, vibration and shock, and long-term aging. Reliability verification is the key to ensuring the continuous operation of the data center.

 

Test Introduction


The reliability test simulates the performance stability of the system under extreme environments and long-term use through thermal cycling, vibration and shock, accelerated aging, and long-term operation tests, and verifies the structural integrity, sealing reliability, and functional durability.

 

Testing Objectives

 

Verify the structural stability of the system in a temperature-changing environment

Evaluate the vibration and shock resistance ability under mechanical stress

Accelerated aging test to predict the system life

Ensure no performance degradation and leakage during long-term operation

 

Test Standards

 

IEC 60068-2 Environmental test series standards

GB/T 2423 Environmental testing for electric and electronic products

YD/T 3979-2021 Technical requirements and test methods for immersion liquid-cooled server systems in data centers

 

Applicable Products/Related Fields


Suitable for scenarios with high reliability requirements such as data center liquid-cooling systems, AI servers, edge computing nodes, and outdoor cabinets.

 

Test Content

 

Thermal cycling test: Temperature cycling from -40°C to 85°C, 500 cycles

Vibration and shock test: Random vibration from 5 to 2000 Hz, 20 g; Half-sine wave shock 50 g

Accelerated aging test: Operate at high temperature and high humidity (85°C/85%RH) for 2000 hours

Long-term operation test: Continuously operate under rated conditions for 1000 hours

 

Project Advantages

 

Capable of simulating the full-process mechanical stress of actual transportation, installation and operation

Conducts accelerated aging under combined stress coupled with temperature and humidity environment

Provides life prediction and failure analysis reports

 

Laboratory Configuration

 

High and low temperature alternating test chamber (-70°C~150°C)

Electromagnetic vibration test system (maximum acceleration 50g)

Impact test bench (semi-sine wave adjustable)

Long-term operation monitoring platform

 

FAQ
Q: How to convert the results of the accelerated aging test into the actual service life?
A: According to the Arrhenius model, high-temperature accelerated aging can be converted into the equivalent operating time at normal temperature. Usually, operating at 85°C/85%RH for 1000 hours corresponds to a service life of 5-10 years at normal temperature.

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