Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Event News|“Unlocking the Secrets to Reliability Enhancement” 2024 Automotive Electronics Reliability Improvement Technology Seminar Successfully Held!
Release date:2024-04-01 00:00
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Focusing on

key issues such as enhancing automotive electronics reliability, failure analysis, and cutting-edge technologies

March 29, 2024

This groundbreaking

Technical Seminar on Enhancing Automotive Electronics Reliability

held at the Suzhou International Conference Hotel

unfolded as a spectacular feast of intellectual exchange

and dynamic collision of ideas.

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The Automotive Electronics Reliability Enhancement Technology Seminar, hosted by Shenzhen Meixin Testing Technology Co., Ltd. (Meixin Testing), brings together top domestic technical experts, industry elites, representatives from research institutes, and professionals from electronics manufacturing, aerospace, and other sectors. Participants will collectively explore new technologies and development trends for enhancing automotive electronics reliability. This conference aims to foster the exchange of innovative ideas, assist enterprises in improving their quality assessment capabilities, gain a firm grasp of current product quality status, and provide effective solutions.




This exchange seminar

invited four industry professionals

to comprehensively, deeply, and from multiple angles

“unlock the secrets to enhancing reliability.”


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Cui Fengzhou, an integrated circuit expert at Meixin Testing, shared insights into typical failure modes of integrated circuits in the electronics manufacturing field through a detailed introduction to ICs. He also analyzed key steps in IC reliability testing, providing a comprehensive and clear explanation of IC reliability evaluation.


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Liu Jinwei, Reliability Expert at Geely Auto, focused on reliability testing and failure analysis of automotive electronic and electrical hardware. Through practical case studies, he highlighted the distinctions between DVP testing and comprehensive stress reliability testing. He further outlined the three levels of reliability testing: the surface application layer, the architectural layer, and the microscopic principle layer. Additionally, he provided forward-looking insights into the future development trends of reliability in the automotive industry.


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Peng Jing, a physical analysis expert at Meixin Testing, highlighted the critical importance of cleanliness control for automotive electronic components. He engaged in discussions with attendees on solutions to further enhance cleanliness management and control, thereby promoting high-quality development within the automotive electronics industry.


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Xue Guanghui, the most influential hands-on expert in PCBA across mainland China, delivered a detailed and vivid comprehensive analysis of PCBA failure analysis methods and applications. This included key elements for formulating failure analysis plans, fundamental skill requirements for failure analysis, process monitoring during failure analysis, and case studies of failure analysis. Packed with practical insights, the session proved immensely valuable to attendees.



This exchange seminar focused on specific topics, broadened perspectives, and fostered innovative thinking.


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Everyone enthusiastically shared their questions with the experts, sparking lively discussions. The atmosphere was vibrant, achieving the desired outcome.


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Now is the time to ride the waves and break through the wind, To hoist our sails and set forth on new voyages. Since its founding in 2012, Meixin Testing has provided clients with full-lifecycle technical services spanning product R&D, manufacturing, and after-sales support. As our credibility and social influence have steadily grown, we have delivered solutions to over 10,000 enterprises.


Future Meixin Testing will continuously enhance its service awareness and capabilities, further expand communication platforms, and deepen collaborative service approaches, striving to establish an industrial hospital service model.



Integrity, Expertise, Service, Teamwork, Mutual Success

Official Website: www.mttlab.com

Hotline: 400-850-4050

Email: marketing@mttlab.com

Providing Material Testing, Failure Analysis, and Technical Consulting Services

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