Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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Event News| 2024 Failure Analysis Targeted Customer Exchange Successfully Held! Maxin Testing Explores Material Failure and Product Optimization with Participants
Release date:2024-04-26 00:00
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Failure Analysis

Holds significant importance

for both product manufacturing and usage

April 26, 2024

At Maxim Testing (Shenzhen Headquarters)

Failure analysis experts

gathered together

to explore material failure mechanisms and product optimization strategies



The Failure Analysis Exchange Conference, hosted by Shenzhen Meixin Testing Technology Co., Ltd. (abbreviated as Meixin Testing), featured multiple thematic presentations and interactive sessions. The event attracted numerous industry experts and scholars, who engaged in face-to-face discussions addressing product challenges. The on-site activities generated an exceptionally vibrant atmosphere.



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Feng Xueliang, an expert in electronic process analysis, delivered an accessible explanation of typical failure modes and mechanisms in PCBs and PCBA. He also shared insights on ten key analytical approaches for failure analysis in electronic manufacturing processes, sparking lively discussion among the audience.


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Wu Bingbing, an expert in metal material failure analysis, provided us with a detailed overview of potential failure issues encountered in the production and use of metal components, along with the underlying causes identified through failure analysis. Through numerous case studies, he demonstrated the various forms of fracture failure in metal components.




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Wang Lijuan, an expert in polymer materials analysis, delivered a highly informative presentation on the structural characteristics, failure modes, and failure features of polymer materials during the conference's highlight segment. Through detailed data and in-depth analysis, she showcased the unique appeal of polymer materials to attendees.


Additionally, failure analysis of polymer materials emerged as a key discussion topic. Participants unanimously agreed that the conference provided a rare opportunity for learning and exchange.


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Expert in electronic component failure analysis, You Qiqian, focused on “Analysis of Typical Failure Cases in Electronic Components.” Through a series of vivid examples, he provided attendees with a more intuitive understanding of failure analysis.


The exchange session also featured multiple Q&A segments, enabling participants to engage in in-depth discussions with the expert on failure analysis-related issues and resolve their current concerns.


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During the tea break, exquisite pastries and tea were served, providing attendees with a relaxed environment for networking.



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The successful hosting of this Failure Analysis Exchange Conference not only provided a valuable platform for industry experts and scholars to engage in dialogue, but also injected new momentum into advancing the fields of materials failure analysis and product optimization.


Moving forward, Meixin Testing will continue to broaden its exchange platforms and deepen collaborative service approaches. Through continuous technological advancement and innovation, we will collectively drive the high-quality development of products.




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