Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
Maxin Testing operates laboratory facilities in Shenzhen, Suzhou, and Beijing, featuring multidisciplinary testing and analytical laboratories. The company pioneers an industrial hospital service model grounded in materials science engineering and electronic reliability engineering.
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The Fifth Technical Salon on Unraveling the Deep Mechanisms of Electrochemical Migration by Meixin Testing in 2024 Concluded Successfully
Release date:2024-08-16 00:00
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On August 15, in Suzhou, the technical salon themed “Unveiling the Deep Mechanisms of Electrochemical Migration,” hosted by Shenzhen Meixin Testing Technology Co., Ltd. (hereinafter referred to as Meixin Testing), concluded successfully.


Industry elites from the electronics sector gathered to engage in in-depth discussions and exchange insights on core topics including electrochemical migration, PCB/PCBA reliability testing, and quality control, collectively exploring the cutting edge of the industry.


In-Depth Analysis of PCB/PCBA Electrochemical Migration:

Preventing Failures, Enhancing Reliability   


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The salon kicked off with Feng Xueliang, Head of Electronic Failure Analysis at Meixin Testing, presenting on the failure mechanisms of electrochemical migration in PCBs/PCBA. He addressed the new challenges arising from the trend toward miniaturization and integration in electronic products. Using vivid case studies and cutting-edge research, he meticulously unraveled the complex process of electrochemical migration while sharing practical prevention strategies. These insights not only broadened attendees' perspectives but also provided robust support for building a more solid foundation of reliability in electronic products.


SIR/CAF Testing: Pinpoint Diagnosis, Quality Assurance

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Subsequently, Zhang Canwen, CAF Project Engineer at Meixin Testing, focused the seminar on SIR and CAF testing—two assessments regarded as the gold standard for evaluating PCB reliability. By showcasing the latest testing methodologies and practical outcomes, he not only shared techniques for enhancing testing precision and efficiency but also emphasized the irreplaceable role of testing in ensuring product quality.


Ion Residue Control: Details Determine Success or Failure


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Addressing the potential quality risk of ionic residue, Xiao Fei, Chief Engineer of the Electronics Product Line at Meixin Testing, leveraged his extensive practical experience and proven case studies to present attendees with a comprehensive and systematic solution for managing ionic residue. He emphasized that success hinges on attention to detail, stressing that only by starting at the source and rigorously controlling every stage of the production process can ionic residue be effectively minimized, ensuring the long-term stable operation of PCB products.


Interactive exchange sparks innovation


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The salon featured a dedicated interactive session, providing attendees with a platform for free exchange and collaborative development. Participants actively posed questions on hot topics such as electrochemical migration, SIR/CAF testing, and ion residue control, while experts offered patient responses, fostering a lively and harmonious atmosphere. This segment not only deepened friendships and cooperation among attendees but also injected fresh momentum into advancing technological progress and innovation within the industry.


Looking ahead, let us create a brilliant future together.


This salon was not only a feast of academic and technical knowledge but also injected powerful momentum into advancing the progress and development of electronic product reliability technology.


Looking ahead, Maxim Testing will persistently strive forward, continuously refining our capabilities to empower customers in enhancing product quality through superior technology and premium services.


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