Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Meixin Testing leverages its technological edge in constructing massive failure databases, showcasing its capabilities through comprehensive case studies, solutions for complex scenarios, partnerships with leading enterprises, and systematic intellectual property. Drawing on millions of failure analyses, it delivers precise insights into root causes, enabling inspection reports to provide robust support for clients' quality upgrades and achieve zero failures.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
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2024 Maxim Technologies Shenzhen “Chip Intelligence Gathering” Technical Salon Successfully Held
Release date:2024-08-22 00:00
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On the afternoon of August 22, under bright sunshine, the “Chip Intelligence Gathering” technical salon hosted by Shenzhen Meixin Testing Technology Co., Ltd. (hereinafter referred to as Meixin Testing) was successfully held. The event attracted numerous experts, scholars, and corporate representatives from the semiconductor field to jointly explore the latest advancements and future trends in semiconductor analysis technology.


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At this “Chip Intelligence Gathering” technical salon, Maxine Testing aims to create a platform for sparking new ideas, fostering in-depth dialogue, and sharing knowledge. We strive to help enterprises strengthen their core capabilities in quality assessment and achieve precise control over product quality.


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The grand opening of this “Chip Intelligence Gathering” technical salon featured You Qiqian, Head of the Laboratory at Maxim Testing's Semiconductor Division. Drawing on over a decade of deep expertise in component testing and analysis, he gradually unveiled the mysteries of “FIB/TEM Applications in the Semiconductor Field.”


With his unique insights and vivid language, Mr. You transformed the complex intricacies of FIB and TEM into an engaging feast of knowledge.


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Immediately following, Chief Engineer Cui Fengzhou of the Semiconductor Division took the stage. Drawing upon his exceptional technical expertise and extensive industry experience, he delivered an authoritative presentation titled “Analyzing Precise Defect Localization Solutions.”


Through vivid case studies and in-depth analysis, Chief Engineer Cui elucidated the precise defect localization technologies employed in semiconductor manufacturing. His insights provided invaluable strategies and perspectives for enhancing product quality.


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Subsequently, Tan Jufang, Head of the DPA Group within the Semiconductor Division, presented the topic “DPA and Authenticity Verification.” In this era of rampant counterfeit and substandard products, Engineer Tan guided attendees through developing a keen eye for identifying genuine components. This approach enhances incoming material quality control, ultimately elevating overall product quality.


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Finally, Zhang Yu, a reliability engineer from the Semiconductor Business Unit, presented the core principles of “Semiconductor Reliability Assessment Methods.”


He provided a detailed overview of the scientific processes and methodologies for semiconductor reliability assessment, offering robust support for developing more reliable and stable semiconductor products.


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Following the conclusion of the event, participants were personally guided by professional engineers on an in-depth tour of the Meixin Testing Shenzhen Integrated Circuit Reliability Analysis and Testing Public Service Platform Laboratory. They gained close-up access to advanced experimental equipment and testing environments. Attendees entered Meixin Testing's semiconductor laboratory and frontline R&D innovation facilities, observing firsthand the operational standards and procedures followed by professional engineers.


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The successful hosting of this “Chip Intelligence Gathering” technical salon showcases Meixin Testing's technical prowess and deep industry expertise in semiconductor failure analysis. As a model national high-tech enterprise, Meixin Testing has dedicated twelve years to meticulous refinement. Leveraging its professional expertise and exceptional service quality, the company has successfully assisted thousands of enterprises in overcoming tens of thousands of complex failure analysis challenges, earning widespread acclaim and deep trust within the industry.


We specialize in delivering customized, high-efficiency solutions. Leveraging our robust professional team and precision cutting-edge testing equipment, Meixin Testing can accurately and swiftly respond to diverse product quality enhancement needs. We have not only significantly shortened testing cycles but also, through deep insight into client requirements, tailored a series of efficient, precise solutions that exceed customer expectations. We are committed to being a steadfast partner and reliable support for enterprises pursuing quality excellence.



Looking ahead, we are filled with anticipation and look forward to reconnecting with you!


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