Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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Choosing the Wrong Metal = Burning Money! A Guide to Avoiding Pitfalls in Metal Selection for Electronics (Part 1)
Release date: 2025-07-11 00:00
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In electronic products, the selection of metal parts directly affects the performance, safety and life of the product. From the mobile phone shell to the aero engine blades, the scientific choice of metal materials is one of the core links of technology research and development. This article will be combined with laboratory testing technology and engineering practice into two parts, detailed and in-depth discussion of the key points of metal material selection cost performance.




Metallic Materials: Elements and Alloys


Metal materials can be divided into pure metal and alloys. Common metal elements include iron (Fe), aluminum (Al), copper (Cu), titanium (Ti), etc., by adjusting the element ratio and process, can form alloys with different properties.

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Steel, stainless steel: 304 stainless steel (Fe+Cr+Ni) corrosion resistance, widely used in daily necessities, such as mobile phone internal bracket has high strength, electromagnetic shielding, ultra-thin processing, the surface can form a passivation anti-rust film; 316 stainless steel additional molybdenum (Mo), corrosion resistance further improved, suitable for medical, marine, aviation and other harsh environments.

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Titanium and titanium alloys: corrosion resistance, high cost; mostly used in high-end areas, such as smart watch back cover with biocompatibility (direct contact with skin without allergenic), high strength (light and thin impact), sweat resistance (salt fog atmosphere environment for a long time is not easy to change color).

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Aluminum and aluminum alloys: light weight, good strength/weight ratio, excellent thermal conductivity, easy processing (casting, extrusion), good corrosion resistance (especially after anodizing), relatively low cost, good recyclability; such as 1xxx (pure aluminum) is often used in wires, heat sinks; 2xxx (Al-Cu) high strength is often used in aerospace materials and so on. 6xxx (Al-Mg-Si) comprehensive performance of excellent high-intensity, good corrosion resistance, a variety of anodizing colors, commonly used in consumer electronics housing, frame, structural parts, radiator.

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Copper and copper alloys: top electrical and thermal conductivity Good corrosion resistance (especially atmospheric environment), bacteriostatic properties, good machinability (stamping, turning), good weldability; but high cost (especially pure copper), easy to oxidize discoloration (need protection), medium strength. Pure copper (C11000) has extremely high electrical and thermal conductivity is often used in wires and radiator substrates; brass has good comprehensive properties: strength, corrosion resistance, machinability, and relatively low cost. The appearance is golden and often applies connector housings, terminals, gears, valves, decorative parts, etc.


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There are other alloys: the lightest structural metal of magnesium alloy has excellent shock absorption, easy die casting, but poor corrosion resistance (strict surface treatment is required); nickel alloy is resistant to high temperature, corrosion resistance (especially strong acid and strong alkali), high strength and oxidation resistance, but the cost is extremely high, high density, processing difficulties, often used in electric wire, resistance wire; zinc alloy low cost, low melting point and easy die casting, can manufacture complex thin-walled parts, good surface treatment performance (easy plating).

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Core logic of material alloy selection


Understand the characteristics of the material, how to choose a scientific choice? The key is to optimize performance through a combination of elements to meet specific needs. An efficient selection process usually follows the following core logic:

Clear component function: What is the main role of it? The structural support? Conductive heat dissipation? Appearance decoration?)

Define the working environment: What will it face? The temperature? Humidity? Corrosion of media? Mechanical stress? The electromagnetic environment?)

Identify manufacturing constraints: How is it processed? Casting? Stamping? CNC?) What are the requirements for cost and production?

Setting cost objectives: What is the budget?

Considering the appearance requirements: Do you need a specific color, gloss, texture?

Screening Candidate Materials : Preliminary screening of several possible materials based on the above conditions.

In-depth evaluation: Compare the performance parameters (strength, conductive conductivity, corrosion resistance, etc.) of the candidate material, machinability, cost, etc.

Prototyping and Validation : Make samples and perform the necessary performance tests (the tests that will be described below).

Final Decision and Confirmation : Synthesize all the information and select the material that best meets your needs.

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Next announcement


At this point, we systematically sort out the characteristics of mainstream metal materials in electronic products, application scenarios and the core logical framework of scientific material selection. Mastering these basic knowledge is the first step to avoid “choosing the wrong material”.

However, how to accurately verify that the actual performance  the material  How to balance performance and cost in complex engineering practices? In the face of the case of material selection errors, how should we analyze and solve it?



"Titanium alloy is light and durable but high in price, how can aluminum alloy rely on comprehensive cost performance to become the dominant consumer electronics?"


Next Next post: 《Save Millions! Metal selection detection pits (next) 》will take you into the laboratory, reveal the key material detection "eyes of fire" (OES, XRF, ICP...), and through the insulation cup selection, smart watch shell, new energy vehicle battery, corrosion failure bolts and other real cases, in-depth analysis of the actual combat skills and pit avoidance guide of the material selection。





July Interactive Gifts Announced

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Failure analysis case book

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Household tool kit




The next article to participate in the July topic interactive activities will have the opportunity to get the lucky gift package, let the beauty welfare officer see which lucky person - please look forward to it!



Relevant cases
Still failing despite meeting IPC standards? The OSP film thickness tolerance vulnerability overlooked by 90% of factories
After undergoing two reflow temperatures, OSP pads exhibited severe solderability issues during wave soldering. Reducing the reflow temperature resolved the solderability problems. This paper analyzes the failure causes and mechanisms of solderability defects on OSP pads and proposes improvement recommendations.
The Truth Behind the 30% Surge in FPC Lead-Free Failure Rates | The “Invisible Killer” of Consumer Electronics
A certain FPC exhibited routing shallowing at certain locations, with both the edges and central areas of the defective samples showing this phenomenon. This paper will conduct a systematic failure analysis to identify the root cause of routing shallowing in the FPC.
Silicone Exceeding Limits = EU Sales Ban? With Global Regulations Tightening, Is Your Product Compliant?
Siloxanes are a class of organosilicon compounds containing Si-O-Si bonds, widely used in rubber, detergents, polishes, adhesives, sealants, and other fields. Due to the environmental and health risks associated with certain siloxanes, numerous countries and regions worldwide have enacted regulations to control their use.
Save Millions! Practical Tips for Avoiding Pitfalls in Metal Material Selection (Part 2)
In the previous article, “Choosing the Wrong Metal = Burning Money! A Guide to Avoiding Pitfalls in Metal Material Selection for Electronics (Part 1),” we established a knowledge framework for metal material properties and applications, and outlined the core steps for scientific material selection. However, theory must be tested by practice. This article will focus on the practical aspects: How can advanced inspection technologies provide reliable data support for material selection decisions? How can performance and cost be skillfully balanced in projects? Real-world case studies will reveal the consequences of improper material selection and the solutions to address them.
Flux compatibility issues with PCBA can actually lead to such severe consequences?!
A PCBA board for an audio product (using wave soldering) suffered burnout during operation. When using flux variant A, failure rates were high; after cleaning, the rate decreased slightly. Switching to flux variant B reduced the defect rate to zero. This paper will employ a series of professional testing and analytical methods to identify the root cause of the failure.
Rigorous Testing! Can Your Phone Handle These Challenges?
In today's era of widespread smartphone adoption, device reliability has become a key concern for users. A highly reliable phone not only delivers a smooth user experience but also remains dependable when it matters most. So, what factors influence smartphone reliability, and how can it be improved? Today, let's delve into these questions.
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