Printed circuit boards and their assemblies (PCB & PCBA) are the core components of electronic products, and their reliability directly determines the overall reliability of electronic products. To ensure and enhance the quality and reliability of electronic products, it is essential to carry out comprehensive physical and chemical analyses of failures, identify the underlying failure mechanisms, and then propose corresponding improvement measures. MTT possesses profound technical expertise in board-level failure analysis, a complete range of analytical methods, a vast database of case studies, and a team of experienced experts, providing you with high-quality and efficient failure analysis services.
The purpose of electronic component failure analysis is to employ a variety of testing and analytical techniques and procedures to identify the failure phenomena of electronic components, determine their failure modes and mechanisms, identify the ultimate root cause of failure, and propose recommendations for improvements in design and manufacturing processes. This helps prevent the recurrence of failures and improves the overall reliability of the components.
The continuous rise in complexity and performance requirements of integrated circuits, combined with potential risks across design, manufacturing, packaging, and application stages, has led to frequent occurrences of critical failure modes such as short circuits, open circuits, leakage, burnout, and parameter drift. These issues not only result in costly device scrapping and system downtime but also often trigger disputes over responsibility among designers, foundries, packaging and testing houses, and end-users, causing significant economic losses and reputational risks.
The performance requirements for polymer materials continue to rise, while differences in understanding of high-demand products and processes between customers and suppliers often lead to frequent failures such as fracture, cracking, corrosion, and discoloration. These failures frequently cause disputes over responsibility and result in significant economic losses.
The increasingly harsh service environments of metal components place higher demands on material performance and structural reliability. However, factors such as design flaws, material defects, manufacturing deviations, or improper use can readily trigger typical failures including fatigue fracture, stress corrosion cracking, hydrogen embrittlement, creep, wear, and overload deformation.
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MTT is a nationally accredited commercial third-party laboratory. We specialize in providing testing services, technical consulting services, and solution services to clients across industries including electronics manufacturing, automotive electronics, semiconductors, and aerospace materials.
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Save Millions! Practical Tips for Avoiding Pitfalls in Metal Material Selection (Part 2)
Release date: 2025-07-21 00:00
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In the previous articleIn , we have established a knowledge framework for the properties and applications of metal materials and sorted out the core steps of scientific material selection. However, the theory needs to be tested in practice.

This article will focus on the actual combat link: how to use advanced detection technology to provide reliable data support for material selection decisions? How to balance performance and cost in a project? And through real cases, the consequences and solutions of improper material selection are revealed.


Is the performance standard?

Key Indicators and Testing Technologies


Composition analysis: Through spectroscopy and chemical analysis, determine whether the content of various elements in the material meets the requirements of the grade composition limit.


2, mechanical properties: including tensile strength, hardness, toughness, ductility, etc., through tensile testing, impact test evaluation.


3, electrical conductivity, thermal conductivity: directly affect the heat dissipation design, such as mobile phone shell need to take into account the thermal and electromagnetic shielding.


Chemical stability: through salt spray test, acid and alkali soaking simulation of the actual use environment (such as insulation cups need to be resistant to water, tea, coffee corrosion).


Fatigue performance: Evaluate the life of the material under the cycle stress and the key performance indicators of long-term safe service (such as car chassis parts).


Microstructure: The metallographic microscope observes the size and distribution of grain and determines the process defects.


Ingredient analysis instruments & testing technology introduction


Laboratory commonly used metal material detection methods and their applicable scenarios:

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Technical comparison:


OES and XRF are suitable for rapid field inspection, but XRF has superior non-destructive properties;

ICP-OES/MS has higher precision, but requires complex pre-processing, and is suitable for laboratory precision analysis.



How to balance performance and cost?


Taking the thermos cup as an example, the selection of materials needs to be considered comprehensively:


Safety: Food grade stainless steel (such as 316) needs to meet the GB 9684 standard austenitic stainless steel.


Corrosion resistance: 316 stainless steel can withstand acidic beverages (such as lemon juice) for a long time because of molybdenum.


Thermal conductivity: The double-layer vacuum structure can reduce thermal conductivity, but the thermal conductivity of the material itself needs to be moderate.


Cost: 304 stainless steel cost-effective, 316 is suitable for high-end demand.


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How to balance performance and cost?


A smart watch shell: use titanium alloy (lightweight + sweat corrosion resistance), through XRF to verify the uniformity of the coating.


New energy vehicle battery housing: the use of aluminum alloy (lightweight + excellent heat dissipation), through the salt spray test to ensure environmental corrosion resistance.


In coastal equipment, 304 bolts are stress-corrosive cracking, and there is no Mo (PREN=19) in 304, which cannot resist chloride ion erosion → 316 containing Mo (PREN=25).


Copper connector plug force attenuation, phosphorus bronze contact after high temperature and high humidity elasticity decline; through component analysis found that the Sn content is insufficient (<5%), insufficient aging, and then recommended to increase Sn to 6-8% (such as C5191).


Aluminum alloy shell intergranular corrosion, the product in the anodized after the corrosion pattern; detection component analysis Fe impurity exceeding the standard (>0.5%) to form the Al3Fe cathode phase, accelerate local corrosion → control Fe <0.2%.


The selection of metal materials is a subtle art that combines material science, testing technology and engineering experience. From accurate component analysis to rigorous performance verification, rigorous data support is required at every step.



Everyone, here’s a good gift waiting for you!

“Down with a little trick.”


Under the premise of ensuring core functions, the most effective metal material you have used is the "cost reduction" method.

A. Search for domestic alternatives (performance standards)

B. Optimized design to reduce material usage

C. Choose a lower-cost alloy grade (such as 6 series aluminum instead of 7 series)

D. Improved process to reduce scrap rates

E. There is no particularly good way for the time being.


F. Other methods


在Share your usual tricks in  (select letters)

And tell the reason.

We will be in the comments section on July 28th.

Choose three fans.

Give the following gift (one choice) 1!


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Failure analysis case book

Image

Household tool kit



Relevant cases
Still failing despite meeting IPC standards? The OSP film thickness tolerance vulnerability overlooked by 90% of factories
After undergoing two reflow temperatures, OSP pads exhibited severe solderability issues during wave soldering. Reducing the reflow temperature resolved the solderability problems. This paper analyzes the failure causes and mechanisms of solderability defects on OSP pads and proposes improvement recommendations.
The Truth Behind the 30% Surge in FPC Lead-Free Failure Rates | The “Invisible Killer” of Consumer Electronics
A certain FPC exhibited routing shallowing at certain locations, with both the edges and central areas of the defective samples showing this phenomenon. This paper will conduct a systematic failure analysis to identify the root cause of routing shallowing in the FPC.
Silicone Exceeding Limits = EU Sales Ban? With Global Regulations Tightening, Is Your Product Compliant?
Siloxanes are a class of organosilicon compounds containing Si-O-Si bonds, widely used in rubber, detergents, polishes, adhesives, sealants, and other fields. Due to the environmental and health risks associated with certain siloxanes, numerous countries and regions worldwide have enacted regulations to control their use.
Choosing the Wrong Metal = Burning Money! A Guide to Avoiding Pitfalls in Metal Selection for Electronics (Part 1)
In electronic products, the selection of metal components directly impacts product performance, safety, and lifespan. From smartphone casings to aircraft engine blades, the scientific selection of metal materials stands as a core element in technological R&D. This article will explore the cost-effectiveness considerations in metal material selection in two parts, integrating laboratory testing techniques with engineering practice.
Flux compatibility issues with PCBA can actually lead to such severe consequences?!
A PCBA board for an audio product (using wave soldering) suffered burnout during operation. When using flux variant A, failure rates were high; after cleaning, the rate decreased slightly. Switching to flux variant B reduced the defect rate to zero. This paper will employ a series of professional testing and analytical methods to identify the root cause of the failure.
Rigorous Testing! Can Your Phone Handle These Challenges?
In today's era of widespread smartphone adoption, device reliability has become a key concern for users. A highly reliable phone not only delivers a smooth user experience but also remains dependable when it matters most. So, what factors influence smartphone reliability, and how can it be improved? Today, let's delve into these questions.
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